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BUF05703PWRG4

Texas Instruments

BUF05703PWRG4 by Texas Instruments

BUF05703PWRG4 by Texas Instruments is a 14-terminal buffer amplifier with small outline and thin profile. It features nickel palladium gold finish, gull wing terminal form, and peak reflow temperature of 260°C. Ideal for applications requiring compact design and high-performance buffering in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,332 parts In-Stock

1+ parts

-

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-

1k+ parts

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5,332

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Digiode

USA . 1,261 parts In-Stock

1+ parts

-

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-

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1,261

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 70 parts In-Stock

1+ parts

$4.213

100+ parts

-

1k+ parts

$4.649

10k+ parts

-

70

$4.213

-

$4.649

-

DigiPath Technology Company

USA . 626 parts In-Stock

1+ parts

$4.639

100+ parts

$4.268

1k+ parts

-

10k+ parts

-

626

$4.639

$4.268

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ChromeModa Solutions

Germany . 6,725 parts In-Stock

1+ parts

$4.734

100+ parts

$3.882

1k+ parts

-

10k+ parts

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6,725

$4.734

$3.882

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$4.734

100+ parts

-

1k+ parts

$4.261

10k+ parts

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1,691

$4.734

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$4.261

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One Stop Electronics

USA . 563 parts In-Stock

1+ parts

$5.410

100+ parts

-

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563

$5.410

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AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$8.680

100+ parts

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212

$8.680

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Lixinc

USA . 7,679 parts In-Stock

1+ parts

-

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7,679

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A-Z Elektronik GmbH

Germany . 6,300 parts In-Stock

1+ parts

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6,300

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Corphita

USA . 4,515 parts In-Stock

1+ parts

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4,515

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Alle Elektronik GmbH

Germany . 4,200 parts In-Stock

1+ parts

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4,200

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Northwest PG Solutions

USA . 2,369 parts In-Stock

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2,369

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Kepictronics

USA . 1,806 parts In-Stock

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1,806

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Native Components

USA . 313 parts In-Stock

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313

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Overview

Elevate your electronic designs with the BUF05703PWRG4 by Texas Instruments, a high-quality buffer amplifier that guarantees top-notch performance and reliability. Crafted by a renowned manufacturer known for innovation and excellence, this product is ideal for a wide range of applications in the electronics industry. With its compact design and advanced features, this buffer amplifier offers unmatched value, benefits, and advantages to customers looking to enhance their electronic projects. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to environmental factors, making this buffer amplifier reliable for various applications.

Surface Mount: YES

Being surface mountable, this buffer amplifier is easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Terminals: 14

With 14 terminals, this buffer amplifier offers versatile connectivity options and can accommodate multiple inputs and outputs.

Maximum Seated Height: 1.2 mm

The low profile of this buffer amplifier allows for compact design solutions, especially in space-constrained applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this buffer amplifier can withstand the rigors of soldering processes without compromising performance.

Technical Specifications

Buffer Amplifiers BUF05703PWRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

BUF05703PWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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