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BUF04701AIDGS

Texas Instruments

BUF04701AIDGS by Texas Instruments

BUF04701AIDGS by Texas Instruments is a CMOS BUFFER with 4 functions, 8 MHz bandwidth, and 1.5 mA max supply current. Ideal for automotive applications, it operates b/w -40 to 125 °C with a Vsup of 5V and dual terminals in a small outline package.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.050

10k+ parts

$0.932

220

-

$1.260

$1.050

$0.932

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,667 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

-

10k+ parts

-

2,667

$0.978

-

-

-

Vyrian

USA . 6,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,121

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 992 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

-

10k+ parts

-

992

$0.927

-

-

-

Component Stockers USA

USA . 5,224 parts In-Stock

1+ parts

$1.050

100+ parts

$0.990

1k+ parts

$2.110

10k+ parts

-

5,224

$1.050

$0.990

$2.110

-

Native Components

USA . 688 parts In-Stock

1+ parts

$1.513

100+ parts

-

1k+ parts

-

10k+ parts

-

688

$1.513

-

-

-

Northwest PG Solutions

USA . 684 parts In-Stock

1+ parts

$1.664

100+ parts

-

1k+ parts

-

10k+ parts

-

684

$1.664

-

-

-

Parana Technologies

USA . 2,172 parts In-Stock

1+ parts

$5.218

100+ parts

-

1k+ parts

$5.830

10k+ parts

-

2,172

$5.218

-

$5.830

-

ChromeModa Solutions

Germany . 2,871 parts In-Stock

1+ parts

$5.863

100+ parts

$4.808

1k+ parts

-

10k+ parts

-

2,871

$5.863

$4.808

-

-

IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$5.863

100+ parts

-

1k+ parts

$5.277

10k+ parts

-

2,102

$5.863

-

$5.277

-

Microchip USA

USA . 2,624 parts In-Stock

1+ parts

$6.435

100+ parts

-

1k+ parts

-

10k+ parts

-

2,624

$6.435

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$8.043

100+ parts

$7.962

1k+ parts

$7.640

10k+ parts

-

100

$8.043

$7.962

$7.640

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

DigiPath Technology Company

USA . 442 parts In-Stock

1+ parts

-

100+ parts

$5.286

1k+ parts

-

10k+ parts

-

442

-

$5.286

-

-

Overview

Experience unparalleled quality and performance with the BUF04701AIDGS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch buffer amplifiers like no other. Ideal for automotive applications, this compact yet powerful device offers a wide range of functions in a small outline package. With a nominal bandwidth of 8 MHz and a maximum supply current of 1.5 mA, the BUF04701AIDGS provides customers with exceptional value, reliability, and precision in their electronic designs. Upgrade your projects today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 7000 uV

Low input offset voltage ensures accurate signal processing and minimal error in the output.

Maximum Average Bias Current (IIB): 0.00001 uA

Low bias current results in minimal power consumption and helps maintain signal integrity.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage of 5V makes it compatible with common power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extended use and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for buffer amplifiers.

Nominal Bandwidth (3dB): 8 MHz

Wide bandwidth allows for the processing of high-frequency signals with minimal distortion.

Technical Specifications

Buffer Amplifiers BUF04701AIDGS attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3.5/12 V

Total Functions:

4

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

8 MHz

Nominal Slew Rate:

10 V/us

Input Offset Voltage Limit:

7 mV

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Maximum Supply Current:

1.5 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP10,.19,20

Trade Compliance

BUF04701AIDGS Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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