Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BUF05703PWG4 by Texas Instruments is a 14-terminal buffer amplifier with small outline and thin profile. It features nickel palladium gold terminal finish, 0.65 mm pitch, and gull wing form. Ideal for applications requiring compact design and high-performance buffering in electronic circuits.
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The plastic/epoxy package body material is lightweight and offers good protection for the internal components, making this buffer amplifier durable and easy to handle.
Being surface mountable allows for easier and more efficient PCB assembly, saving space and reducing overall production costs.
The rectangular package shape ensures efficient use of board space and easy integration into existing circuit designs.
With 14 terminals, this buffer amplifier offers a wide range of connection options, making it versatile for different applications.
The small outline, thin profile, and shrink pitch package style allows for compact and space-saving circuit designs, ideal for applications where size is a concern.
The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the product.
The dual terminal position allows for easy and secure connections, enhancing the overall reliability and stability of the buffer amplifier.
With a low seated height of 1.2 mm, this buffer amplifier is suitable for applications with limited vertical space, offering greater flexibility in design.
The compact width of 4.4 mm makes this buffer amplifier suitable for compact circuit designs, where space optimization is essential.
With a length of 5 mm, this buffer amplifier is compact and space-efficient, making it ideal for applications with size constraints.
The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance of the buffer amplifier.
As a buffer amplifier, this product can provide signal amplification with minimal distortion and high input impedance, ideal for maintaining signal integrity in electronic circuits.
The 0.65 mm terminal pitch enables high-density mounting and precise placement on the PCB, enhancing the overall performance and efficiency of the buffer amplifier.
Buffer Amplifiers BUF05703PWG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments
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BUF05703PWG4 Amplifiers trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.33.00.01
SB
8542.33.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
Shenzhen Yixinsemi Electronics
Fairchild Semiconductor
General Instrument
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Sangdest Microelectronics (Nanjing)
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
1554216002
Molex
WIRE AND CABLE;
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BUF03FJ
Analog Devices
BUF03FJ by Analog Devices is a BUFFER amplifier with 50 MHz bandwidth, 28000 uV max input offset voltage, and 180 V/us min slew rate. It operates in commercial temperature range of 0-70 °C and is ideal for precision signal buffering in various electronic applications.
AD8075ARU
AD8075ARU by Analog Devices is a Buffer Amplifier with 550 MHz bandwidth, 10 uA bias current, and 40000 uV input offset voltage. It is used in industrial applications for signal buffering due to its high bandwidth and low bias current requirements.
MAX4174ABEUK
Maxim Integrated
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR;
MAX4217EUA+
MAX4217EUA+ by Analog Devices is a dual-function buffer amplifier with 230 MHz bandwidth, 15000 uV input offset voltage, and 12 uA average bias current. It operates in industrial temperature range (-40 to 85 °C) and supports power supplies of 3.3/5/+-5 V. Ideal for applications requiring high-speed signal buffering in compact spaces.
MAX2472
BUFFER; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LH0033G
Alpha Semiconductor
BUFFER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: SQUARE;
LMH6560MT
LMH6560MT by Texas Instruments is a buffer amplifier with 4 functions, operating at -40 to 85 °C. It has a max input offset voltage of 25,000 uV and a max average bias current of 14 uA. Ideal for applications requiring high precision signal buffering in compact spaces.
HOS200AH
HOS200AH by Analog Devices is a 12-terminal BUFFER amplifier with 200 MHz bandwidth, 1000 V/us slew rate, and -25 to 85 °C operating temperature range. Ideal for applications requiring high-speed signal buffering in METAL package style.
MAX469C/D
BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Maximum Supply Voltage Limit: 6 V;
CLC110AJE
CLC110AJE by Texas Instruments is a buffer amplifier with 90 MHz bandwidth, 8000 uV max input offset voltage, and 500 V/us min slew rate. Ideal for industrial applications requiring high-speed signal buffering in a compact package with dual terminals and -40 to 85 °C operating temperature range.
CLC115AMC
The Texas Instruments CLC115AMC is a buffer amplifier with 4 functions, offering a nominal bandwidth of 700 MHz and a min slew rate of 2200 V/us. Ideal for applications requiring high-speed signal buffering in environments with temperatures ranging from -55 to 125 °C.
MAX4207EUK-T
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
BUF04701AIDGSRG4
BUF04701AIDGSRG4 by Texas Instruments is a CMOS BUFFER with 8 MHz bandwidth, 7000 uV max input offset voltage, and 1.5 mA max supply current. Ideal for automotive applications due to its small outline, low bias current of 0.00001 uA, and wide operating temperature range from -40 to 125 °C.
BUF03BJ
BUF03BJ by Analog Devices is a BUFFER amplifier with 50MHz bandwidth, 35000uV max input offset voltage, and 180V/us min slew rate. Ideal for military applications due to its MIL-TEMP rating and cylindrical package style.
MAX4017ESA+
MAX4017ESA+ by Analog Devices is a Buffer Amplifier with 140 MHz Bandwidth, 20 uA Bias Current, and 20000 uV Input Offset Voltage. It operates in industrial temperatures, has a supply voltage of 5V, and is ideal for signal buffering applications.
BUF05704AIPWPR
BUF05704AIPWPR by Texas Instruments is a 4-function buffer amplifier with a supply voltage of 18V. It features a bandwidth of 1MHz, low bias current of 0.0002uA, and max offset voltage of 20000uV. Ideal for applications requiring precise signal buffering in compact designs.
MAX470CPE
BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MAX4278MJA
BUFFER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CLC231AM
BUFFER;
EL5123CY-T7
Renesas Electronics
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
BUF05704AIPWPRG4
BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: HTSSOP; Package Shape: RECTANGULAR;
BUF05704AIPWP
BUF04701AIPWR
BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF04701AIDGS
BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
BUF06703PW
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF05704AIPWPG4
BUF06703PWRG4
BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF05703PWR
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF04701AIPW
BUF04701AIDGSR
BUF04701AIDGSR by Texas Instruments is a CMOS buffer amplifier with a max input offset voltage of 7000 uV. It has a nominal bandwidth of 8 MHz and is suitable for automotive applications.
BUF06703PWG4
BUFFER; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF04701AIPWRG4
BUF06703PWR
BUF06704AIPWPG4
BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;
BUF06704AIPWP
BUF05703PWRG4
BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
BUF05703PW
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