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BUF05703PWG4

Texas Instruments

BUF05703PWG4 by Texas Instruments

BUF05703PWG4 by Texas Instruments is a 14-terminal buffer amplifier with small outline and thin profile. It features nickel palladium gold terminal finish, 0.65 mm pitch, and gull wing form. Ideal for applications requiring compact design and high-performance buffering in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,604 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,604

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Vyrian

USA . 3,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,829

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 318 parts In-Stock

1+ parts

$1.279

100+ parts

-

1k+ parts

$2.039

10k+ parts

-

318

$1.279

-

$2.039

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$1.408

100+ parts

-

1k+ parts

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10k+ parts

-

836

$1.408

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-

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ChromeModa Solutions

Germany . 3,896 parts In-Stock

1+ parts

$1.437

100+ parts

$1.178

1k+ parts

-

10k+ parts

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3,896

$1.437

$1.178

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$1.437

100+ parts

-

1k+ parts

$1.293

10k+ parts

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1,705

$1.437

-

$1.293

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One Stop Electronics

USA . 402 parts In-Stock

1+ parts

$7.410

100+ parts

-

1k+ parts

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10k+ parts

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402

$7.410

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$19.333

100+ parts

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619

$19.333

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Corphita

USA . 3,312 parts In-Stock

1+ parts

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3,312

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Northwest PG Solutions

USA . 721 parts In-Stock

1+ parts

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721

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Native Components

USA . 557 parts In-Stock

1+ parts

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557

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Microchip USA

USA . 454 parts In-Stock

1+ parts

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100+ parts

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454

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Overview

Elevate your electronic designs with the BUF05703PWG4 by Texas Instruments, a top-of-the-line Buffer Amplifier that promises unmatched quality and reliability. Crafted with precision and expertise, this product is a testament to the manufacturer's commitment to excellence. Perfect for a wide range of applications, this amplifier offers superior performance and functionality, making it an essential component for any project. Experience the value and benefits of the BUF05703PWG4 today and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and offers good protection for the internal components, making this buffer amplifier durable and easy to handle.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving space and reducing overall production costs.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of board space and easy integration into existing circuit designs.

No. of Terminals: 14

With 14 terminals, this buffer amplifier offers a wide range of connection options, making it versatile for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for compact and space-saving circuit designs, ideal for applications where size is a concern.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the product.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections, enhancing the overall reliability and stability of the buffer amplifier.

Maximum Seated Height: 1.2 mm

With a low seated height of 1.2 mm, this buffer amplifier is suitable for applications with limited vertical space, offering greater flexibility in design.

Width: 4.4 mm

The compact width of 4.4 mm makes this buffer amplifier suitable for compact circuit designs, where space optimization is essential.

Length: 5 mm

With a length of 5 mm, this buffer amplifier is compact and space-efficient, making it ideal for applications with size constraints.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance of the buffer amplifier.

Amplifier Type: BUFFER

As a buffer amplifier, this product can provide signal amplification with minimal distortion and high input impedance, ideal for maintaining signal integrity in electronic circuits.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enables high-density mounting and precise placement on the PCB, enhancing the overall performance and efficiency of the buffer amplifier.

Technical Specifications

Buffer Amplifiers BUF05703PWG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

BUF05703PWG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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