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BUF04701AIPW

Texas Instruments

BUF04701AIPW by Texas Instruments

BUF04701AIPW by Texas Instruments is a CMOS BUFFER with 4 functions, 8 MHz bandwidth, and 7000 uV max input offset voltage. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style.

Median Price

$1.813

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.370

1,977

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$1.620

$1.450

$1.370

DigiKey

USA . 1,977 parts In-Stock

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$2.140

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$2.140

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Verical

USA . 1,977 parts In-Stock

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-

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$1.813

10k+ parts

$1.712

1,977

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-

$1.813

$1.712

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,361 parts In-Stock

1+ parts

$1.720

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2,361

$1.720

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Vyrian

USA . 2,638 parts In-Stock

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$1.810

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2,638

$1.810

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 107 parts In-Stock

1+ parts

$1.496

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107

$1.496

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Corphita

USA . 2,197 parts In-Stock

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$1.629

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2,197

$1.629

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Northwest PG Solutions

USA . 768 parts In-Stock

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$1.646

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768

$1.646

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Parana Technologies

USA . 525 parts In-Stock

1+ parts

$1.801

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$2.359

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525

$1.801

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$2.359

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Component Stockers USA

USA . 1,097 parts In-Stock

1+ parts

$1.860

100+ parts

$1.750

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$1.570

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1,097

$1.860

$1.750

$1.570

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DigiPath Technology Company

USA . 814 parts In-Stock

1+ parts

$1.984

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814

$1.984

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ChromeModa Solutions

Germany . 1,744 parts In-Stock

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$2.024

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$1.660

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1,744

$2.024

$1.660

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$2.024

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$1.822

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590

$2.024

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$1.822

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S.R.D Solutions

India . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Overview

Enhance your electronic designs with the top-quality BUF04701AIPW buffer amplifier from Texas Instruments. This versatile component offers exceptional performance and reliability, making it ideal for a wide range of applications. Whether you're working on automotive electronics or industrial automation systems, this buffer amplifier delivers the value and benefits you need to take your projects to the next level. Trust in Texas Instruments for cutting-edge technology that meets your demands for precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the overall weight of the product light.

Maximum Input Offset Voltage: 7000 uV

Allows for precise and accurate signal amplification without significant distortion.

Maximum Average Bias Current (IIB): 0.00001 uA

Ensures minimal power consumption and efficient operation.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 6

Optimal supply voltage for stable performance.

Nominal Bandwidth (3dB): 8 MHz

Provides ample bandwidth for a wide range of signal amplification applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high reliability.

Technical Specifications

Buffer Amplifiers BUF04701AIPW attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

4

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

8 MHz

Nominal Slew Rate:

10 V/us

Input Offset Voltage Limit:

7 mV

Peak Bias Current:

10 pA

Operational Characteristics

Nominal Supply Voltage:

6 V

Maximum Supply Voltage:

6.6 V

Nominal Negative Supply Voltage (Vsup):

-6 V

Maximum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

BUF04701AIPW Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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