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BUF634F/500E3

Texas Instruments

BUF634F/500E3 by Texas Instruments

BUF634F/500E3 by Texas Instruments is a buffer amplifier with 180MHz bandwidth, 100000uV max input offset voltage, and 20uA max bias current. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style.

Median Price

$15.101

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$15.101

100+ parts

-

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20

$15.101

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Digiode

USA . 4,218 parts In-Stock

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4,218

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Vyrian

USA . 3,680 parts In-Stock

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3,680

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VNN

France . 2,831 parts In-Stock

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2,831

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Chip Stock

USA . 205 parts In-Stock

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205

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QIE Inc.

USA . 82 parts In-Stock

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82

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,586 parts In-Stock

1+ parts

$0.410

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1,586

$0.410

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Semicontronic

India . 286 parts In-Stock

1+ parts

$4.410

100+ parts

$4.300

1k+ parts

$4.278

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286

$4.410

$4.300

$4.278

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One Stop Electronics

USA . 1,080 parts In-Stock

1+ parts

$5.410

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1,080

$5.410

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Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

$6.393

100+ parts

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$7.143

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1,028

$6.393

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$7.143

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$7.183

100+ parts

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$6.465

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1,848

$7.183

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$6.465

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ChromeModa Solutions

Germany . 1,756 parts In-Stock

1+ parts

$7.183

100+ parts

$5.890

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1,756

$7.183

$5.890

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AZTECH Wire

Italy . 289 parts In-Stock

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$14.620

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289

$14.620

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Continental Prestige Electronics

USA . 6,642 parts In-Stock

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$15.101

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$14.798

6,642

$15.101

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$14.798

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$15.101

100+ parts

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1k+ parts

$14.345

10k+ parts

$14.043

2,000

$15.101

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$14.345

$14.043

Corohmni

South Africa . 120 parts In-Stock

1+ parts

$16.107

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120

$16.107

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.590

100+ parts

$15.761

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$15.761

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500

$16.590

$15.761

$15.761

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Modulus Dynamics

Lithuania . 600 parts In-Stock

1+ parts

$16.762

100+ parts

$16.594

1k+ parts

$16.091

10k+ parts

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600

$16.762

$16.594

$16.091

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Microchip USA

USA . 222 parts In-Stock

1+ parts

$42.840

100+ parts

$42.530

1k+ parts

$42.530

10k+ parts

$42.220

222

$42.840

$42.530

$42.530

$42.220

Component Stockers USA

USA . 202 parts In-Stock

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$99.990

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202

$99.990

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A-Z Elektronik GmbH

Germany . 5,574 parts In-Stock

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5,574

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Argo Parts USA

USA . 3,867 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,716 parts In-Stock

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3,716

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Corphita

USA . 2,779 parts In-Stock

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2,779

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DigiPath Technology Company

USA . 1,311 parts In-Stock

1+ parts

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$6.476

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1,311

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$6.476

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Overview

Elevate your audio experience with the BUF634F/500E3 by Texas Instruments, a top-of-the-line buffer amplifier designed to deliver unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications in automotive and industrial settings. With its compact design and impressive performance capabilities, the BUF634F/500E3 offers customers exceptional value and benefits, making it the ideal choice for all your buffering needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic and epoxy materials provide durability and resistance to environmental factors, making the product reliable for long-term use.

Maximum Input Offset Voltage: 100000 uV

High maximum input offset voltage ensures accurate signal processing and minimal distortion in the output signal.

Nominal Supply Voltage / Vsup (V): 15

Stable nominal supply voltage of 15V ensures consistent performance of the amplifier.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of -40 to 125°C allows the amplifier to function in various environmental conditions.

Nominal Bandwidth (3dB): 180 MHz

High bandwidth of 180 MHz enables the amplifier to process high-frequency signals accurately.

Technology: BIPOLAR

Bipolar technology ensures low noise and high performance, making this buffer amplifier suitable for demanding applications.

Amplifier Type: BUFFER

Being a buffer amplifier, it provides impedance matching, signal isolation, and signal buffering capabilities, making it ideal for various signal processing applications.

Technical Specifications

Buffer Amplifiers BUF634F/500E3 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

180 MHz

Nominal Slew Rate:

2000 V/us

Input Offset Voltage Limit:

100 mV

Peak Bias Current:

20 uA

Maximum Bias Current (IIB) @25 °C:

20 uA

Operational Characteristics

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.4 in (10.16 mm)

Width:

0.351 in (8.925 mm)

Maximum Seated Height:

0.202 in (5.13 mm)

Total Terminals:

5

Terminal Pitch:

0.067 in (1.7 mm)

Terminal Position:

Single

Terminal Style:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SMSIP5H,.6,67TB

Trade Compliance

BUF634F/500E3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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