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BUF07703PWPRG4

Texas Instruments

BUF07703PWPRG4 by Texas Instruments

BUF07703PWPRG4 by Texas Instruments is a 20-terminal buffer amplifier with small outline package. Featuring nickel palladium gold finish, it has a compact size of 6.5mm x 4.4mm and terminal pitch of 0.65mm. Ideal for applications requiring low-profile components in surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,343 parts In-Stock

1+ parts

-

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5,343

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Digiode

USA . 1,652 parts In-Stock

1+ parts

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1k+ parts

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1,652

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 64 parts In-Stock

1+ parts

$3.094

100+ parts

-

1k+ parts

$3.612

10k+ parts

-

64

$3.094

-

$3.612

-

DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$3.406

100+ parts

$3.134

1k+ parts

-

10k+ parts

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2,236

$3.406

$3.134

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ChromeModa Solutions

Germany . 6,309 parts In-Stock

1+ parts

$3.476

100+ parts

$2.850

1k+ parts

-

10k+ parts

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6,309

$3.476

$2.850

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IDEA Electronic Components Group

UK . 1,496 parts In-Stock

1+ parts

$3.476

100+ parts

-

1k+ parts

$3.128

10k+ parts

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1,496

$3.476

-

$3.128

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One Stop Electronics

USA . 158 parts In-Stock

1+ parts

$5.410

100+ parts

-

1k+ parts

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10k+ parts

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158

$5.410

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AZTECH Wire

Italy . 843 parts In-Stock

1+ parts

$14.165

100+ parts

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843

$14.165

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A-Z Elektronik GmbH

Germany . 5,148 parts In-Stock

1+ parts

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5,148

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Microchip USA

USA . 4,424 parts In-Stock

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4,424

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Corphita

USA . 4,239 parts In-Stock

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4,239

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Alle Elektronik GmbH

Germany . 3,432 parts In-Stock

1+ parts

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3,432

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Kepictronics

USA . 1,200 parts In-Stock

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1,200

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Native Components

USA . 1,000 parts In-Stock

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1,000

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Northwest PG Solutions

USA . 758 parts In-Stock

1+ parts

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758

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Overview

Elevate your electronic designs with the BUF07703PWPRG4 by Texas Instruments. Crafted with precision and expertise, this buffer amplifier offers unparalleled quality and reliability. Perfect for a wide range of applications, this versatile component ensures optimal performance and seamless integration. Experience the value of enhanced signals and improved efficiency with this cutting-edge product. Upgrade your projects today with the superior advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to various environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, making it suitable for compact electronic devices.

No. of Terminals: 20

Having 20 terminals provides multiple connection points for enhanced functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The combination of small outline, heat sink/slug, thin profile, and shrink pitch design results in a compact and efficient buffer amplifier suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable signal transmission and longevity of the product.

Terminal Position: DUAL

Dual terminal position provides redundancy and backup connection points, increasing the product's reliability in case of one terminal failure.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a slim profile design, enabling the integration of this buffer amplifier in space-constrained electronic devices.

Width: 4.4 mm

Narrow width of 4.4 mm helps in optimizing the layout of circuit boards and allows for efficient placement of components in a limited space.

Length: 6.5 mm

Compact length of 6.5 mm contributes to the overall space-saving design of this buffer amplifier, making it suitable for small electronic devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during installation, ensuring secure and reliable connections.

Amplifier Type: BUFFER

Being a buffer amplifier, this product helps maintain signal integrity and prevent signal degradation, making it an essential component in various electronic systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for precise soldering and compact layout on circuit boards, enhancing the overall efficiency and performance of the product.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that this product has moderate sensitivity to moisture, making it suitable for use in environments with controlled humidity levels.

Technical Specifications

Buffer Amplifiers BUF07703PWPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Physical Characteristics

Length:

0.256 in (6.5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

20

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF07703PWPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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