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LM310JG

Texas Instruments

LM310JG by Texas Instruments

LM310JG by Texas Instruments is a buffer amplifier with 8 terminals and ceramic package. It operates at temperatures from 0 to 70°C, with supply voltages of ±15V. Ideal for commercial applications requiring dual terminal position and through-hole form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,137 parts In-Stock

1+ parts

-

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8,137

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-

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Digiode

USA . 2,370 parts In-Stock

1+ parts

-

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-

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2,370

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 850 parts In-Stock

1+ parts

$4.149

100+ parts

-

1k+ parts

$4.595

10k+ parts

-

850

$4.149

-

$4.595

-

DigiPath Technology Company

USA . 600 parts In-Stock

1+ parts

$4.569

100+ parts

$4.203

1k+ parts

-

10k+ parts

-

600

$4.569

$4.203

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-

ChromeModa Solutions

Germany . 4,902 parts In-Stock

1+ parts

$4.662

100+ parts

$3.823

1k+ parts

-

10k+ parts

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4,902

$4.662

$3.823

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$4.662

100+ parts

-

1k+ parts

$4.196

10k+ parts

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2,304

$4.662

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$4.196

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One Stop Electronics

USA . 767 parts In-Stock

1+ parts

$8.410

100+ parts

-

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767

$8.410

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$13.470

100+ parts

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755

$13.470

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Corphita

USA . 1,934 parts In-Stock

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1,934

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Overview

Elevate your electronic designs with the LM310JG by Texas Instruments, a top-of-the-line buffer amplifier that guarantees unparalleled quality and performance. Crafted by the reputable manufacturer, this versatile component offers a wide range of applications in various industries. From ensuring precise signal integrity to enhancing circuit efficiency, the LM310JG is the ideal solution for all your amplification needs. Trust Texas Instruments to deliver excellence, reliability, and innovation with every product, setting you apart from the competition and exceeding customer expectations. Elevate your projects with the LM310JG and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent heat dissipation and mechanical protection, making the amplifier more durable and reliable.

Nominal Supply Voltage / Vsup (V): 15

Operating at a nominal supply voltage of 15V allows for efficient power usage and consistent performance.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this amplifier can withstand demanding environments without overheating.

Amplifier Type: BUFFER

Being a buffer amplifier, this product can isolate input and output circuits to prevent signal distortion and maintain signal integrity.

Nominal Negative Supply Voltage (Vsup): -15 V

The availability of a negative supply voltage of -15V allows for flexibility in power configurations and ensures stable operation.

Technical Specifications

Buffer Amplifiers LM310JG attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Nominal Supply Voltage:

15 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Ceramic

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

LM310JG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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