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LMC6008IM

Texas Instruments

LMC6008IM by Texas Instruments

LMC6008IM by Texas Instruments is a buffer amplifier with 8 functions, operating at -40 to 85 °C. It has a max input offset voltage of 25000 uV and a min slew rate of 1.7 V/us. Ideal for applications requiring low bias current and high supply voltage up to 16V in compact designs.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,677 parts In-Stock

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Digiode

USA . 2,974 parts In-Stock

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2,974

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Anansix

USA . 1,852 parts In-Stock

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1,852

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Bristol Electronics

USA . 60 parts In-Stock

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$1.313

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60

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$1.313

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Distributors (Availability)

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One Stop Electronics

USA . 927 parts In-Stock

1+ parts

$0.410

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927

$0.410

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Parana Technologies

USA . 2,094 parts In-Stock

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$4.121

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$4.573

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2,094

$4.121

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$4.573

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DigiPath Technology Company

USA . 1,660 parts In-Stock

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$4.537

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$4.174

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1,660

$4.537

$4.174

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ChromeModa Solutions

Germany . 4,580 parts In-Stock

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$4.630

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$3.797

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4,580

$4.630

$3.797

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IDEA Electronic Components Group

UK . 578 parts In-Stock

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$4.630

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$4.167

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578

$4.630

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$4.167

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AZTECH Wire

Italy . 463 parts In-Stock

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$6.029

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463

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 433 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the LMC6008IM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The LMC6008IM falls under the category of Buffer Amplifiers, offering a versatile solution for a wide range of applications. With low bias current and high slew rate capabilities, this amplifier provides exceptional performance while maintaining a compact size. Trust Texas Instruments for innovative solutions that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and robustness to the product, making it suitable for various environments and applications.

Maximum Input Offset Voltage: 25000 uV

Low input offset voltage ensures accurate and precise signal processing, improving overall performance.

Maximum Average Bias Current (IIB): 0.3 uA

Low bias current minimizes power consumption and reduces errors in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 14.5

Optimal supply voltage ensures stable and reliable operation of the amplifier.

Minimum Slew Rate: 1.7 V/us

Fast slew rate enables quick response to input signals, improving dynamic performance of the amplifier.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the amplifier suitable for harsh environmental conditions and industrial applications.

Amplifier Type: BUFFER

Buffer amplifier design provides high input impedance and low output impedance, making it ideal for impedance matching and signal isolation.

Technical Specifications

Buffer Amplifiers LMC6008IM attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

8

Performance Specifications

Minimum Slew Rate:

1.7 V/us

Input Offset Voltage Limit:

25 mV

Peak Bias Current:

300 nA

Maximum Bias Current (IIB) @25 °C:

300 nA

Operational Characteristics

Maximum Supply Current:

6.5 mA

Nominal Supply Voltage:

14.5 V

Maximum Supply Voltage:

16 V

Lowest Output Current:

150 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.606 in (15.4 mm)

Width:

0.295 in (7.5 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Total Terminals:

24

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

R-PDSO-G24

Packaging and Shipping

Packing Method:

Rails

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP24,.4

Trade Compliance

LMC6008IM Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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