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LMH6321MR

Texas Instruments

LMH6321MR by Texas Instruments

LMH6321MR by Texas Instruments is a buffer amplifier with a max bandwidth of 110MHz, ideal for automotive applications. It operates at temperatures ranging from -40 to 125°C and has a low bias current of 17uA. With a compact package style and surface mount capability, it offers high performance in a small form factor.

Median Price

$5.170

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,270 parts In-Stock

1+ parts

$2.870

100+ parts

$2.810

1k+ parts

$2.760

10k+ parts

-

2,270

$2.870

$2.810

$2.760

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$7.470

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1

$7.470

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Distributors (In-Stock)

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Digiode

USA . 2,787 parts In-Stock

1+ parts

$3.924

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2,787

$3.924

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Vyrian

USA . 3,448 parts In-Stock

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$4.130

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3,448

$4.130

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Chip Stock

USA . 2,514 parts In-Stock

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2,514

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Anansix

USA . 2,000 parts In-Stock

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2,000

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Sensible Micro Corp

USA . 84 parts In-Stock

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84

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ComSIT Distribution GmbH

Germany . 75 parts In-Stock

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75

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North Shore Components

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

$2.626

10k+ parts

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1,302

$2.110

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$2.626

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DigiPath Technology Company

USA . 1,998 parts In-Stock

1+ parts

$2.324

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$2.138

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1,998

$2.324

$2.138

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ChromeModa Solutions

Germany . 5,182 parts In-Stock

1+ parts

$2.371

100+ parts

$1.944

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5,182

$2.371

$1.944

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IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$2.371

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$2.134

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271

$2.371

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$2.134

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Vigor

Singapore . 1,970 parts In-Stock

1+ parts

$3.600

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1,970

$3.600

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Corphita

USA . 4,411 parts In-Stock

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$3.717

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4,411

$3.717

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QUARKTWIN TECHNOLOGY LTD

USA . 24,315 parts In-Stock

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Microchip USA

USA . 5,710 parts In-Stock

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5,710

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Perfect Parts

USA . 110 parts In-Stock

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110

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Overview

Elevate your audio experience with the LMH6321MR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The LMH6321MR falls under the category of Buffer Amplifiers, making it ideal for various applications. With a nominal bandwidth of 110 MHz and a maximum input offset voltage of 52000 uV, this product offers unmatched performance and precision. Experience the value of seamless connectivity and enhanced sound quality with the LMH6321MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and highly resistant to damage.

Maximum Input Offset Voltage: 52000 uV

Low input offset voltage ensures accurate and precise signal processing.

Nominal Supply Voltage / Vsup (V): 15

Stable nominal supply voltage provides consistent performance.

Nominal Bandwidth (3dB): 110 MHz

High bandwidth allows for fast signal processing and high-frequency applications.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, ensuring reliability in harsh temperature conditions.

Technical Specifications

Buffer Amplifiers LMH6321MR attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±5/±15 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

110 MHz

Nominal Slew Rate:

2900 V/us

Input Offset Voltage Limit:

52 mV

Peak Bias Current:

17 uA

Maximum Bias Current (IIB) @25 °C:

17 uA

Operational Characteristics

Maximum Supply Current:

20.5 mA

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Supply Voltage:

-18 V

Lowest Output Current:

300 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.194 in (4.93 mm)

Width:

0.155 in (3.94 mm)

Maximum Seated Height:

0.066 in (1.68 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile

Package Equivalence Code:

SOP8,.25

Trade Compliance

LMH6321MR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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