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LMH6321MRX

Texas Instruments

LMH6321MRX by Texas Instruments

LMH6321MRX by Texas Instruments is a buffer amplifier with a bandwidth of 110 MHz, ideal for automotive applications. It has a max input offset voltage of 52000 uV and operates at temperatures ranging from -40 to 125 °C. With low bias current (17 uA) and small outline package style, it's suitable for compact designs requiring high-speed signal buffering.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,233 parts In-Stock

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Digiode

USA . 4,689 parts In-Stock

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Anansix

USA . 2,725 parts In-Stock

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2,725

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Chip Stock

USA . 2,514 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,841 parts In-Stock

1+ parts

$2.356

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-

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$2.855

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1,841

$2.356

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$2.855

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Ampacity Inc.

Singapore . 1,629 parts In-Stock

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$2.410

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ChromeModa Solutions

Germany . 5,236 parts In-Stock

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$2.647

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$2.171

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$2.647

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IDEA Electronic Components Group

UK . 889 parts In-Stock

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$2.647

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$2.382

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One Stop Electronics

USA . 671 parts In-Stock

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$8.410

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671

$8.410

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AZTECH Wire

Italy . 298 parts In-Stock

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$13.108

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Component Stockers USA

USA . 677 parts In-Stock

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$99.990

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Microchip USA

USA . 7,661 parts In-Stock

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Continental Prestige Electronics

USA . 3,547 parts In-Stock

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Argo Parts USA

USA . 2,898 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Corphita

USA . 1,763 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 426 parts In-Stock

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$2.387

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Perfect Parts

USA . 314 parts In-Stock

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Overview

Unlock the full potential of your electronic designs with the LMH6321MRX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality buffer amplifiers that provide exceptional performance and reliability. Whether you're working on audio equipment, instrumentation, or communication systems, this versatile amplifier is sure to enhance your design with its high bandwidth and low distortion. Experience the value and benefits of the LMH6321MRX today and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components, making the product suitable for various environments.

Maximum Input Offset Voltage: 52000 uV

Low input offset voltage ensures accurate signal processing and minimal distortion in the output signal.

Maximum Average Bias Current (IIB): 17 uA

Low bias current helps in reducing power consumption and ensures stable performance over time.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage / Vsup (V): 15

Nominal supply voltage of 15V provides sufficient power for the amplifier to operate effectively.

Power Supplies (V): +-5/+-15

Dual power supply options (+-5V and +-15V) offer flexibility in powering the amplifier according to application requirements.

Nominal Bandwidth (3dB): 110 MHz

High bandwidth capability of 110 MHz allows the amplifier to process high-frequency signals accurately.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable performance in extreme temperature conditions, making it suitable for automotive applications.

Technical Specifications

Buffer Amplifiers LMH6321MRX attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±5/±15 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

110 MHz

Nominal Slew Rate:

2900 V/us

Input Offset Voltage Limit:

52 mV

Peak Bias Current:

17 uA

Maximum Bias Current (IIB) @25 °C:

17 uA

Operational Characteristics

Maximum Supply Current:

20.5 mA

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Supply Voltage:

-18 V

Lowest Output Current:

300 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.194 in (4.93 mm)

Width:

0.155 in (3.94 mm)

Maximum Seated Height:

0.066 in (1.68 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile

Package Equivalence Code:

SOP8,.25

Trade Compliance

LMH6321MRX Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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