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LMH6559MAX/NOPB

Texas Instruments

LMH6559MAX/NOPB by Texas Instruments

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.762

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 51,168 parts In-Stock

1+ parts

$2.208

100+ parts

$1.935

1k+ parts

$1.093

10k+ parts

-

51,168

$2.208

$1.935

$1.093

-

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$7.785

100+ parts

$7.707

1k+ parts

-

10k+ parts

-

100

$7.785

$7.707

-

-

Rochester

USA . 50,900 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.410

10k+ parts

$1.330

50,900

-

$1.580

$1.410

$1.330

Verical

USA . 50,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.762

10k+ parts

$1.663

50,900

-

-

$1.762

$1.663

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.459

2,500

-

-

-

$1.459

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$1.222

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$1.222

-

-

-

Digiode

USA . 5,084 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

-

10k+ parts

-

5,084

$1.444

-

-

-

Vyrian

USA . 30,767 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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30,767

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-

-

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Anansix

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2,855

-

-

-

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Netsource Technology, Inc.

USA . 2,365 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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2,365

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 30,862 parts In-Stock

1+ parts

$1.170

100+ parts

-

1k+ parts

-

10k+ parts

-

30,862

$1.170

-

-

-

Corphita

USA . 3,843 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

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3,843

$1.368

-

-

-

Parana Technologies

USA . 1,237 parts In-Stock

1+ parts

$1.719

100+ parts

$159.597

1k+ parts

$1.547

10k+ parts

-

1,237

$1.719

$159.597

$1.547

-

DigiPath Technology Company

USA . 138 parts In-Stock

1+ parts

$1.892

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$1.892

-

-

-

ChromeModa Solutions

Germany . 4,190 parts In-Stock

1+ parts

$1.931

100+ parts

$1.583

1k+ parts

-

10k+ parts

-

4,190

$1.931

$1.583

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IDEA Electronic Components Group

UK . 598 parts In-Stock

1+ parts

$1.931

100+ parts

-

1k+ parts

$1.738

10k+ parts

-

598

$1.931

-

$1.738

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$7.785

100+ parts

$7.707

1k+ parts

$7.395

10k+ parts

-

100

$7.785

$7.707

$7.395

-

Kepictronics

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,986

-

-

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A-Z Elektronik GmbH

Germany . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,986

-

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,000

-

-

-

-

Technical Specifications

Buffer Amplifiers LMH6559MAX/NOPB attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1050 MHz

Nominal Unity Gain Bandwidth:

1750 MHz

Nominal Slew Rate:

4580 V/us

Input Offset Voltage Limit:

25 mV

Peak Bias Current:

14 uA

Operational Characteristics

Maximum Supply Current:

14 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.5 V

Lowest Output Current:

50 A

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.902 mm)

Width:

0.154 in (3.899 mm)

Maximum Seated Height:

0.069 in (1.753 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

LMH6559MAX/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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