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DS15BA101SDX

Texas Instruments

DS15BA101SDX by Texas Instruments

DS15BA101SDX by Texas Instruments is a buffer amplifier with 8 terminals, Vsup of 3.3V, and max temp of 85°C. Ideal for industrial applications due to its small square package shape and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,391 parts In-Stock

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Anansix

USA . 1,983 parts In-Stock

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Digiode

USA . 1,622 parts In-Stock

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1,622

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Distributors (Availability)

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Native Components

USA . 125 parts In-Stock

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$0.689

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125

$0.689

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Northwest PG Solutions

USA . 1,127 parts In-Stock

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$0.758

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$0.758

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One Stop Electronics

USA . 388 parts In-Stock

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$2.410

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388

$2.410

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Parana Technologies

USA . 88 parts In-Stock

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$4.257

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$4.688

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88

$4.257

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$4.688

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$4.687

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$4.687

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ChromeModa Solutions

Germany . 1,977 parts In-Stock

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$4.783

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$3.922

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$3.922

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IDEA Electronic Components Group

UK . 1,301 parts In-Stock

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$4.783

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$4.305

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1,301

$4.783

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AZTECH Wire

Italy . 372 parts In-Stock

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$18.634

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Corphita

USA . 190 parts In-Stock

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Overview

Elevate your electronic designs with the DS15BA101SDX by Texas Instruments, a high-quality buffer amplifier that offers unmatched performance and reliability. Manufactured by one of the industry leaders, this square-shaped surface mount package is perfect for a wide range of applications. From enhancing signal integrity to improving system efficiency, this versatile amplifier delivers exceptional value and benefits to customers looking for precision and consistency in their projects. Upgrade your designs today with the DS15BA101SDX and experience the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, providing versatility in different environments.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact and efficient design with heat sink capabilities for optimal performance.

Amplifier Type: BUFFER

Specifically designed as a buffer amplifier, providing signal isolation and impedance matching.

Technical Specifications

Buffer Amplifiers DS15BA101SDX attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

3.465 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Trade Compliance

DS15BA101SDX Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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