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DS15BA101SD

Texas Instruments

DS15BA101SD by Texas Instruments

DS15BA101SD by Texas Instruments is a buffer amplifier with 8 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.3V and small outline package style. Ideal for industrial applications requiring low-profile components with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,681 parts In-Stock

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Digiode

USA . 4,004 parts In-Stock

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Anansix

USA . 876 parts In-Stock

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Prism Electronics

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Native Components

USA . 953 parts In-Stock

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$1.430

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Northwest PG Solutions

USA . 153 parts In-Stock

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$1.573

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One Stop Electronics

USA . 511 parts In-Stock

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Parana Technologies

USA . 196 parts In-Stock

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$6.578

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$7.318

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DigiPath Technology Company

USA . 830 parts In-Stock

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$7.243

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$6.664

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$7.243

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ChromeModa Solutions

Germany . 3,777 parts In-Stock

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$7.391

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$6.061

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IDEA Electronic Components Group

UK . 1,775 parts In-Stock

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$6.652

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AZTECH Wire

Italy . 479 parts In-Stock

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Corphita

USA . 2,276 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality DS15BA101SD Buffer Amplifier by Texas Instruments. With a compact square package design and industrial-grade temperature range, this surface-mount amplifier offers reliable performance for various applications. From signal conditioning to voltage buffering, this versatile amplifier provides value and benefits to customers seeking precision and efficiency in their projects. Trust Texas Instruments to deliver top-notch products that elevate your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Designed for compatibility with standard voltage levels, ensuring seamless integration into existing systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Terminal Finish: TIN LEAD

Provides a reliable and durable connection, enhancing the longevity and performance of the amplifier.

Amplifier Type: BUFFER

As a buffer amplifier, it can isolate the input from the output, improving signal strength and reducing interference.

Technical Specifications

Buffer Amplifiers DS15BA101SD attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

3.465 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin Lead

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Trade Compliance

DS15BA101SD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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