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LMV112SD/NOPB

Texas Instruments

LMV112SD/NOPB by Texas Instruments

LMV112SD/NOPB by Texas Instruments is a buffer amplifier with 2 functions, operating at a supply voltage of 2.7-5.5V and bandwidth of 40MHz. Ideal for industrial applications, it has a small outline package style, operates in temperatures from -40 to 85°C, and has a low supply current of 2.1mA.

Median Price

$1.229

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

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$0.857

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$0.857

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Chip1Stop

Japan . 56 parts In-Stock

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$1.070

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$0.721

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$1.070

$0.721

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Texas Instruments

USA . 370,973 parts In-Stock

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$1.388

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$1.068

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$0.562

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370,973

$1.388

$1.068

$0.562

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Element14

Singapore . 50 parts In-Stock

1+ parts

$1.869

100+ parts

$1.340

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$0.858

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$0.842

50

$1.869

$1.340

$0.858

$0.842

DigiKey

USA . 1,183 parts In-Stock

1+ parts

$1.930

100+ parts

$1.157

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$1.016

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$0.943

1,183

$1.930

$1.157

$1.016

$0.943

Mouser Electronics

USA . 840 parts In-Stock

1+ parts

$1.930

100+ parts

$1.160

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$1.010

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$0.959

840

$1.930

$1.160

$1.010

$0.959

Farnell

UK . 50 parts In-Stock

1+ parts

-

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$0.999

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$0.879

10k+ parts

$0.862

50

-

$0.999

$0.879

$0.862

Verical

USA . 50 parts In-Stock

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$0.721

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50

-

$0.721

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Distributors (In-Stock)

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Digiode

USA . 2,220 parts In-Stock

1+ parts

$1.016

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$1.016

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Vyrian

USA . 46,870 parts In-Stock

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TME

Poland . 2,000 parts In-Stock

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$1.022

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Anansix

USA . 1,498 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 975 parts In-Stock

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975

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Bristol Electronics

USA . 866 parts In-Stock

1+ parts

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$1.219

1k+ parts

$0.682

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866

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$1.219

$0.682

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Goldney Electronics S.L.

Spain . 641 parts In-Stock

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Prism Electronics

USA . 158 parts In-Stock

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Connector Distribution Corp

USA . 66 parts In-Stock

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Right Parts Inc.

USA . 66 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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A2Z Electronics, Inc.

USA . 20 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 46,907 parts In-Stock

1+ parts

$0.550

100+ parts

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$0.550

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Corphita

USA . 2,839 parts In-Stock

1+ parts

$0.963

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2,839

$0.963

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Continental Prestige Electronics

USA . 93 parts In-Stock

1+ parts

$1.050

100+ parts

$0.743

1k+ parts

$0.499

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93

$1.050

$0.743

$0.499

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Component Stockers USA

USA . 352,731 parts In-Stock

1+ parts

$1.060

100+ parts

$0.890

1k+ parts

$0.600

10k+ parts

$0.600

352,731

$1.060

$0.890

$0.600

$0.600

Corohmni

South Africa . 5 parts In-Stock

1+ parts

$2.670

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5

$2.670

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Parana Technologies

USA . 2,056 parts In-Stock

1+ parts

$5.582

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$6.371

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2,056

$5.582

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$6.371

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DigiPath Technology Company

USA . 1,238 parts In-Stock

1+ parts

$6.147

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$5.655

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$6.147

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

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$6.272

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$5.645

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1,655

$6.272

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ChromeModa Solutions

Germany . 82 parts In-Stock

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$6.272

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$5.143

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$6.272

$5.143

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Perfect Parts

USA . 16,561 parts In-Stock

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Lixinc

USA . 14,041 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,452 parts In-Stock

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Argo Parts USA

USA . 1,802 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 900 parts In-Stock

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Kepictronics

USA . 627 parts In-Stock

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Andel Nordic

Denmark . 447 parts In-Stock

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Futuretech Components

Singapore . 237 parts In-Stock

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Overview

Enhance your electronic designs with the LMV112SD/NOPB by Texas Instruments, a top-quality buffer amplifier that excels in performance and reliability. With a sleek package design and versatile surface-mount capabilities, this dual-function amplifier offers a wide range of applications for industrial-grade projects. Experience the benefits of precise signal buffering, high-speed operation, and low power consumption, making it an ideal choice for demanding environments where efficiency is key. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LMV112SD/NOPB today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the amplifier, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage for efficient performance and power consumption, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring stability and reliability in demanding industrial environments.

Nominal Bandwidth (3dB): 40 MHz

High bandwidth allows for fast signal processing and precise amplification, making it ideal for high-frequency applications.

Amplifier Type: BUFFER

As a buffer amplifier, it provides impedance matching and signal isolation, enhancing signal quality and reducing loading effects.

Technical Specifications

Buffer Amplifiers LMV112SD/NOPB attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

40 MHz

Nominal Slew Rate:

110 V/us

Operational Characteristics

Maximum Supply Current:

2.1 mA

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Lowest Output Current:

16 A

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Trade Compliance

LMV112SD/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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