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BUF06704AIPWPR

Texas Instruments

BUF06704AIPWPR by Texas Instruments

BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.384

1k+ parts

$0.319

10k+ parts

$0.284

6,000

-

$0.384

$0.319

$0.284

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.330

10k+ parts

-

6,000

-

-

$0.330

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.398

10k+ parts

$0.355

6,000

-

-

$0.398

$0.355

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,978 parts In-Stock

1+ parts

$0.298

100+ parts

-

1k+ parts

-

10k+ parts

-

4,978

$0.298

-

-

-

Vyrian

USA . 978 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

-

10k+ parts

-

978

$0.314

-

-

-

DigiKey Marketplace

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.330

1k+ parts

-

10k+ parts

-

6,000

-

$0.330

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 388 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

-

10k+ parts

-

388

$0.283

-

-

-

Parana Technologies

USA . 80 parts In-Stock

1+ parts

$0.575

100+ parts

-

1k+ parts

$1.668

10k+ parts

-

80

$0.575

-

$1.668

-

DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

$0.633

-

-

-

ChromeModa Solutions

Germany . 3,089 parts In-Stock

1+ parts

$0.646

100+ parts

$0.530

1k+ parts

-

10k+ parts

-

3,089

$0.646

$0.530

-

-

IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$0.646

100+ parts

-

1k+ parts

$0.581

10k+ parts

-

2,020

$0.646

-

$0.581

-

Corohmni

South Africa . 221 parts In-Stock

1+ parts

$0.778

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$0.778

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$3.481

100+ parts

$3.168

1k+ parts

$2.854

10k+ parts

-

40

$3.481

$3.168

$2.854

-

Native Components

USA . 979 parts In-Stock

1+ parts

$5.190

100+ parts

-

1k+ parts

-

10k+ parts

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979

$5.190

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,790

-

-

-

-

Northwest PG Solutions

USA . 522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.086

10k+ parts

-

522

-

-

$5.086

-

Microchip USA

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Technical Specifications

Buffer Amplifiers BUF06704AIPWPR attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

6

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1 MHz

Nominal Slew Rate:

1.6 V/us

Input Offset Voltage Limit:

20 mV

Peak Bias Current:

200 pA

Operational Characteristics

Nominal Supply Voltage:

18 V

Maximum Supply Voltage:

19 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF06704AIPWPR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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