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LM110JG

Texas Instruments

LM110JG by Texas Instruments

LM110JG by Texas Instruments is a ceramic buffer amplifier with +-15V power supplies. It has 8 terminals, operates b/w -55 to 125 °C, and is MILITARY grade. This IN-LINE package is ideal for applications requiring high precision and reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,229

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-

-

Digiode

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,426

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 460 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

460

$3.410

-

-

-

Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

$5.394

100+ parts

-

1k+ parts

$6.087

10k+ parts

-

1,059

$5.394

-

$6.087

-

ChromeModa Solutions

Germany . 5,926 parts In-Stock

1+ parts

$6.061

100+ parts

$4.970

1k+ parts

-

10k+ parts

-

5,926

$6.061

$4.970

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$6.061

100+ parts

-

1k+ parts

$5.455

10k+ parts

-

1,373

$6.061

-

$5.455

-

AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$15.234

100+ parts

-

1k+ parts

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10k+ parts

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844

$15.234

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Corphita

USA . 3,239 parts In-Stock

1+ parts

-

100+ parts

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3,239

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.465

1k+ parts

-

10k+ parts

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1,000

-

$5.465

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Overview

Elevate your electronic designs with the LM110JG buffer amplifier by Texas Instruments. Crafted with precision using high-quality materials, this military-grade component ensures reliable performance in extreme temperatures. Perfect for a wide range of applications, from audio systems to industrial machinery, the LM110JG offers unparalleled value and benefits. Trust Texas Instruments for superior quality and choose the LM110JG for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and stable material, providing excellent protection for the internal components of the buffer amplifier, ensuring long-term reliability and performance.

Nominal Supply Voltage / Vsup (V): 15

Operating at a nominal supply voltage of 15V allows for compatibility with a wide range of power sources, making this buffer amplifier versatile in various applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this buffer amplifier can withstand high heat environments, making it suitable for industrial or automotive applications.

Amplifier Type: BUFFER

Being a buffer amplifier, it provides impedance matching and signal isolation capabilities, making it ideal for buffering signals between different components in a circuit.

Technical Specifications

Buffer Amplifiers LM110JG attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Nominal Supply Voltage:

15 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Ceramic

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

LM110JG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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