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LMV115MG

Texas Instruments

LMV115MG by Texas Instruments

LMV115MG by Texas Instruments is a buffer amplifier with 6 terminals, operating voltage of 2.8-3.6V, and small outline package style. It has a max supply current of 0.52mA, slow rate of 18 V/us, and min output current of 0.00005A. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 46 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

-

46

$0.770

$0.580

$0.500

-

Digiode

USA . 2,549 parts In-Stock

1+ parts

-

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2,549

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Vyrian

USA . 2,265 parts In-Stock

1+ parts

-

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2,265

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Euro-Tech

UK . 1,000 parts In-Stock

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-

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1,000

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Anansix

USA . 287 parts In-Stock

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-

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287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,313 parts In-Stock

1+ parts

$1.410

100+ parts

-

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1,313

$1.410

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Parana Technologies

USA . 1,622 parts In-Stock

1+ parts

$2.636

100+ parts

-

1k+ parts

$3.126

10k+ parts

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1,622

$2.636

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$3.126

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$2.903

100+ parts

-

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558

$2.903

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ChromeModa Solutions

Germany . 1,795 parts In-Stock

1+ parts

$2.962

100+ parts

$2.429

1k+ parts

-

10k+ parts

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1,795

$2.962

$2.429

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IDEA Electronic Components Group

UK . 1,202 parts In-Stock

1+ parts

$2.962

100+ parts

-

1k+ parts

$2.666

10k+ parts

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1,202

$2.962

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$2.666

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$15.842

100+ parts

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595

$15.842

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Alle Elektronik GmbH

Germany . 3,232 parts In-Stock

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3,232

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Corphita

USA . 1,873 parts In-Stock

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1,873

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Overview

Unlock the power of precision with the Texas Instruments LMV115MG Buffer Amplifier. Crafted with top-notch quality by a trusted manufacturer, this versatile component is designed to enhance your applications with unbeatable performance. From electronics and telecommunications to industrial automation, the LMV115MG delivers unmatched value and reliability. Elevate your projects with this compact, efficient solution that offers exceptional benefits and advantages. Experience the difference with Texas Instruments LMV115MG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protects the internal circuitry of the buffer amplifier.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 2.8

Operates at a low nominal supply voltage of 2.8V, making it suitable for low-power applications and aiding in energy efficiency.

Maximum Operating Temperature: 85 °C

Can operate at up to 85°C, ensuring reliable performance even in high-temperature environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, enhancing overall product reliability.

Amplifier Type: BUFFER

Being a buffer amplifier, it provides impedance matching and signal isolation, improving signal quality and transmission within a circuit.

Technical Specifications

Buffer Amplifiers LMV115MG attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Performance Specifications

Nominal Slew Rate:

18 V/us

Operational Characteristics

Maximum Supply Current:

520 μA

Nominal Supply Voltage:

2.8 V

Maximum Supply Voltage:

3.6 V

Lowest Output Current:

50 μA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

R-PDSO-G6

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP6,.08

Trade Compliance

LMV115MG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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