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TSL1014IYF

STMicroelectronics

TSL1014IYF by STMicroelectronics

TSL1014IYF by STMicroelectronics is a square buffer amplifier in a 48-terminal flatpack package. It features surface mount technology and gull-wing terminals for easy integration. Ideal for signal buffering in compact electronic designs, it ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,679 parts In-Stock

1+ parts

-

100+ parts

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2,679

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-

-

-

Vyrian

USA . 1,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

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-

-

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Digiode

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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114

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$5.175

100+ parts

-

1k+ parts

$4.658

10k+ parts

-

652

$5.175

-

$4.658

-

MKK Technologies

India . 993 parts In-Stock

1+ parts

$9.731

100+ parts

-

1k+ parts

-

10k+ parts

-

993

$9.731

-

-

-

DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$9.731

100+ parts

-

1k+ parts

-

10k+ parts

-

993

$9.731

-

-

-

Corphita

USA . 206 parts In-Stock

1+ parts

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206

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Parana Technologies

USA . 158 parts In-Stock

1+ parts

-

100+ parts

$6.188

1k+ parts

-

10k+ parts

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158

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$6.188

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Overview

Elevate your design with the TSL1014IYF from STMicroelectronics, a leading innovator in electronic components. This premium buffer amplifier ensures exceptional signal integrity, making it ideal for a variety of applications, from consumer electronics to industrial systems. With its compact surface mount design and robust performance, you'll benefit from enhanced reliability and efficiency, empowering your projects with superior quality and value that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent durability and resistance to environmental factors, making this buffer amplifier suitable for a wide range of applications.

Surface Mount: YES

With surface mount technology, this buffer amplifier allows for more efficient use of space on PCBs and facilitates automated assembly processes.

Package Shape: SQUARE

The square package shape simplifies placement and alignment on PCBs, enhancing design flexibility and integration into various layouts.

No. of Terminals: 48

Having 48 terminals enables robust connectivity options and facilitates more complex circuit designs, ensuring reliable performance.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile, which is ideal for compact designs where space is at a premium.

Terminal Position: QUAD

Quad terminal positioning enhances thermal performance and signal integrity, making it a suitable choice for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals provide improved solderability and mechanical strength, ensuring reliable connections in various environments.

Amplifier Type: BUFFER

As a buffer amplifier, it provides high input impedance and low output impedance, making it perfect for signal isolation and impedance matching in many electronic applications.

Technical Specifications

Buffer Amplifiers TSL1014IYF attributes and parameters. Explore more Buffer Amplifiers devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Sub-Category:

Buffer Amplifiers

Physical Characteristics

Total Terminals:

48

Terminal Position:

Quad

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Qualified:

No

Standards

JESD-30 Code:

S-PQFP-G48

Packaging and Shipping

Package Shape:

Package Style:

Flatpack

Trade Compliance

TSL1014IYF Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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