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TSL1014IYFT

STMicroelectronics

TSL1014IYFT by STMicroelectronics

TSL1014IYFT by STMicroelectronics is a square buffer amplifier in a 48-terminal flatpack design, ideal for surface mount applications. It features a peak reflow temp of 260 °C and MSL 3 moisture sensitivity. This component ensures reliable performance in electronic circuits.

Median Price

$1.174

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.174

2,031

-

-

-

$1.174

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,613 parts In-Stock

1+ parts

$1.256

100+ parts

-

1k+ parts

-

10k+ parts

-

4,613

$1.256

-

-

-

ComSIT Distribution GmbH

Germany . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

4,800

-

-

-

-

Digiode

USA . 3,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,405

-

-

-

-

Anansix

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,645

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 268 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$2.350

-

-

-

Vigor

Singapore . 2,034 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$2.770

-

-

-

IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$3.404

100+ parts

-

1k+ parts

$3.064

10k+ parts

-

1,422

$3.404

-

$3.064

-

MKK Technologies

India . 1,777 parts In-Stock

1+ parts

$6.401

100+ parts

-

1k+ parts

-

10k+ parts

-

1,777

$6.401

-

-

-

DigiPath Technology Company

USA . 1,777 parts In-Stock

1+ parts

$6.401

100+ parts

-

1k+ parts

-

10k+ parts

-

1,777

$6.401

-

-

-

A-Z Elektronik GmbH

Germany . 7,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,152

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-

-

-

Perfect Parts

USA . 3,604 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,604

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-

-

-

Corphita

USA . 2,512 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,512

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-

-

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Parana Technologies

USA . 898 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

-

10k+ parts

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898

-

$4.070

-

-

Overview

Elevate your design with the TSL1014IYFT from STMicroelectronics, a leader in innovative semiconductor solutions. This premium buffer amplifier promises exceptional performance and reliability across various applications, from consumer electronics to industrial systems. Its surface-mount convenience and robust construction ensure seamless integration and long-lasting durability. Harness the power of STMicroelectronics for unmatched quality and efficiency that drives your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

This surface mount capability allows for easy integration into modern compact electronic designs, making the product versatile and suitable for high-density applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and allows for effective thermal management, enhancing performance in tight layouts.

No. of Terminals: 48

Having 48 terminals provides flexibility for complex circuit designs, enabling the implementation of multiple features and functions in a single device.

Package Style (Meter): FLATPACK

The flatpack style contributes to a low profile, making it ideal for applications where space is at a premium and requires a sleek design.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and ensures good electrical conductivity, reducing the risk of corrosion and improving overall device performance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing on the PCB and simplifies the design process, making it an excellent choice for engineers.

Maximum Time At Peak Reflow Temperature: 40 s

With a maximum time of 40 seconds at peak reflow temperature, this product is compatible with various soldering processes, further enhancing its adaptability in production.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capability ensures that the device can withstand rigorous assembly processes, making it suitable for robust applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical connections and is compatible with automated soldering processes, reducing assembly time and improving reliability.

Amplifier Type: BUFFER

As a buffer amplifier, this component provides high input impedance and low output impedance, making it ideal for signal isolation and integrity in various circuits.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a balanced sensitivity to moisture, making it suitable for standard handling processes with proper precautions.

Technical Specifications

Buffer Amplifiers TSL1014IYFT attributes and parameters. Explore more Buffer Amplifiers devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Reflow Peak Time Limit:

40 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Total Terminals:

48

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Qualified:

No

Standards

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Packaging and Shipping

Package Shape:

Package Style:

Flatpack

Trade Compliance

TSL1014IYFT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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