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TSL1018IF

STMicroelectronics

TSL1018IF by STMicroelectronics

TSL1018IF by STMicroelectronics is a high-performance buffer amplifier with a max input offset voltage of 12 mV and operates within -40 °C to 95°C. It features a nominal voltage of 5V and supports surface mount applications. Ideal for industrial use, it offers a bandwidth of 3.5 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,718 parts In-Stock

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4,718

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Anansix

USA . 664 parts In-Stock

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664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 648 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

$2.657

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648

$2.952

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$2.657

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MKK Technologies

India . 1,934 parts In-Stock

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$5.552

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$5.552

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DigiPath Technology Company

USA . 1,934 parts In-Stock

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$5.552

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1,934

$5.552

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AZTECH Wire

Italy . 680 parts In-Stock

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$12.490

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680

$12.490

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Microchip USA

USA . 4,047 parts In-Stock

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4,047

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Corphita

USA . 2,885 parts In-Stock

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Vigor

Singapore . 2,370 parts In-Stock

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2,370

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Parana Technologies

USA . 1,192 parts In-Stock

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$3.530

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$3.530

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Overview

Unlock unparalleled performance with the TSL1018IF buffer amplifier from STMicroelectronics, a trusted leader in innovative electronics. Designed for reliability in demanding environments, this compact and efficient solution excels across various applications, from industrial automation to consumer electronics. Experience superior signal integrity and minimal power consumption, empowering your projects to achieve greater efficiency and longevity. Elevate your designs with STMicroelectronics' commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Maximum Input Offset Voltage: 12000 uV

A low maximum input offset voltage results in better accuracy and precision in signal amplification, enhancing overall performance.

Maximum Average Bias Current (IIB): 0.14 uA

The low bias current contributes to reduced power consumption, making the product ideal for battery-operated devices.

Surface Mount: YES

Surface mount capabilities allow for easier integration into compact designs, saving space on PCBs.

Package Shape: SQUARE

A square package shape helps in efficient use of board space and allows for convenient placement in a variety of layouts.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V offers compatibility with common digital logic levels, facilitating easier circuit design.

Number of Terminals: 48

With 48 terminals, the product provides numerous connection options, enhancing its utility in complex circuits.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack design with heat sink capability allows for efficient thermal management, which is essential for maintaining performance under heavy loads.

Maximum Supply Voltage Limit: 18 V

A maximum supply voltage limit of 18V provides flexibility in applications requiring higher voltage levels without compromising performance.

Maximum Operating Temperature: 95 °C

A high operating temperature limit allows the product to function reliably in demanding environments, suitable for industrial conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is ideal for harsh environments and outdoor applications.

Terminal Position: QUAD

The quad terminal position improves layout efficiency and simplifies routing in PCB designs.

Maximum Seated Height: 1.2 mm

A low seated height allows for a thinner profile, accommodating designs with space restrictions.

Width: 7 mm

A width of 7 mm ensures compatibility with standard components and efficiency in PCB layout.

Nominal Bandwidth (3dB): 3.5 MHz

A nominal bandwidth of 3.5 MHz enables the amplifier to handle a wide range of frequencies, making it versatile for various applications.

Length: 7 mm

The dimension of 7 mm allows the component to fit seamlessly in compact configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliability and performance in extreme environmental conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure robust connections, enhancing assembly quality.

Amplifier Type: BUFFER

As a buffer amplifier, it provides high input impedance and low output impedance, ideal for driving heavy loads.

Nominal Negative Supply Voltage (Vsup): -5 V

The ability to operate with a negative supply voltage allows for more versatile signal processing, particularly in analog applications.

Nominal Slew Rate: 1.1 V/us

A slew rate of 1.1 V/us indicates the ability to respond quickly to changes in input, ensuring accurate signal reproduction.

Terminal Pitch: 0.5 mm

A finer terminal pitch of 0.5 mm allows for more compact designs and increased component density on PCBs.

Minimum Output Current: 0.15 A

The capability to provide a minimum output current of 0.15 A makes this buffer amplifier suitable for driving heavier loads efficiently.

Technical Specifications

Buffer Amplifiers TSL1018IF attributes and parameters. Explore more Buffer Amplifiers devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

3.5 MHz

Nominal Slew Rate:

1.1 V/us

Input Offset Voltage Limit:

12 mV

Peak Bias Current:

140 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Lowest Output Current:

150 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

95 °C (203 °F)

Physical Characteristics

Length:

0.276 in (7 mm)

Width:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

48

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PQFP-G48

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Trade Compliance

TSL1018IF Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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