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BUF11702PWPRG4

Texas Instruments

BUF11702PWPRG4 by Texas Instruments

BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;

Median Price

$1.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 130,000 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.200

10k+ parts

$1.070

130,000

-

$1.440

$1.200

$1.070

DigiKey

USA . 130,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.800

10k+ parts

-

130,000

-

-

$0.800

-

Verical

USA . 130,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

130,000

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,596 parts In-Stock

1+ parts

$0.732

100+ parts

-

1k+ parts

-

10k+ parts

-

4,596

$0.732

-

-

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Vyrian

USA . 2,953 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

2,953

$0.770

-

-

-

DigiKey Marketplace

USA . 254,000 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

-

10k+ parts

-

254,000

-

$1.230

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 302 parts In-Stock

1+ parts

$0.693

100+ parts

-

1k+ parts

-

10k+ parts

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302

$0.693

-

-

-

Native Components

USA . 733 parts In-Stock

1+ parts

$1.659

100+ parts

-

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733

$1.659

-

-

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Northwest PG Solutions

USA . 836 parts In-Stock

1+ parts

$1.825

100+ parts

-

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836

$1.825

-

-

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Parana Technologies

USA . 557 parts In-Stock

1+ parts

$4.722

100+ parts

-

1k+ parts

$5.216

10k+ parts

-

557

$4.722

-

$5.216

-

DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$5.200

100+ parts

$4.784

1k+ parts

-

10k+ parts

-

695

$5.200

$4.784

-

-

ChromeModa Solutions

Germany . 4,957 parts In-Stock

1+ parts

$5.306

100+ parts

$4.351

1k+ parts

-

10k+ parts

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4,957

$5.306

$4.351

-

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IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$5.306

100+ parts

-

1k+ parts

$4.775

10k+ parts

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2,188

$5.306

-

$4.775

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Assy Fe

Spain . 16,000 parts In-Stock

1+ parts

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16,000

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Kepictronics

USA . 14,678 parts In-Stock

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14,678

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Metaverse IC Inc.

Canada . 14,678 parts In-Stock

1+ parts

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14,678

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QUARKTWIN TECHNOLOGY LTD

USA . 2,335 parts In-Stock

1+ parts

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2,335

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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1,800

-

-

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,200

-

-

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Microchip USA

USA . 213 parts In-Stock

1+ parts

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213

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Technical Specifications

Buffer Amplifiers BUF11702PWPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1 MHz

Nominal Slew Rate:

1 V/us

Input Offset Voltage Limit:

15 mV

Peak Bias Current:

200 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Physical Characteristics

Length:

0.382 in (9.7 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

28

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G28

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF11702PWPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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