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TCA4311DR

Texas Instruments

TCA4311DR by Texas Instruments

TCA4311DR by Texas Instruments is an 8-terminal buffer amplifier with a supply voltage of 3V to 7V. It operates in industrial temperatures from -40°C to 85°C, with a max input offset voltage of 175000uV. This small outline package is ideal for applications requiring low output current and surface mount compatibility.

Median Price

$4.351

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2,500 parts In-Stock

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$4.351

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Vyrian

USA . 7,074 parts In-Stock

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TME

Poland . 2,500 parts In-Stock

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$3.840

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$3.840

ComSIT Distribution GmbH

Germany . 1,426 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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Bristol Electronics

USA . 159 parts In-Stock

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Microfarads

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Parana Technologies

USA . 1,707 parts In-Stock

1+ parts

$0.869

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$1.814

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$0.869

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$1.814

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DigiPath Technology Company

USA . 2,366 parts In-Stock

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$0.956

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$0.880

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2,366

$0.956

$0.880

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ChromeModa Solutions

Germany . 5,356 parts In-Stock

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$0.976

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$0.800

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

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$0.976

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$0.878

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1,639

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$0.878

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Advanced Electronics

New Zealand . 1,916 parts In-Stock

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$2.676

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$2.649

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$2.542

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$2.542

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AZTECH Wire

Italy . 348 parts In-Stock

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$16.160

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Microchip USA

USA . 265 parts In-Stock

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$18.190

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$18.140

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$18.140

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$18.080

265

$18.190

$18.140

$18.140

$18.080

Lixinc

USA . 15,543 parts In-Stock

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Corphita

USA . 2,483 parts In-Stock

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Component Stockers USA

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Kepictronics

USA . 1,781 parts In-Stock

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A-Z Elektronik GmbH

Germany . 745 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality TCA4311DR buffer amplifier from Texas Instruments. With a wide operating temperature range and a compact small outline package, this versatile component is ideal for various applications in industrial settings. Trust in Texas Instruments' reputation for reliability and innovation to deliver superior performance and precision. Experience the value and benefits of this top-of-the-line buffer amplifier, offering customers unmatched quality and efficiency. Upgrade your projects today with the TCA4311DR for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for industrial applications.

Maximum Input Offset Voltage: 175000 uV

Low input offset voltage ensures high precision and accuracy in signal processing.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a low supply voltage, making it suitable for low-power applications.

Maximum Supply Voltage Limit: 7 V

With a maximum supply voltage of 7V, the product can handle a wide range of input voltages.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance.

Maximum Supply Current: 7 mA

Low supply current consumption makes the product energy-efficient.

Technical Specifications

Buffer Amplifiers TCA4311DR attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Input Offset Voltage Limit:

175 mV

Operational Characteristics

Maximum Supply Current:

7 mA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Output Current:

50 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TCA4311DR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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