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TCA4311DG4

Texas Instruments

TCA4311DG4 by Texas Instruments

TCA4311DG4 by Texas Instruments is a buffer amplifier with 8 terminals, Vsup of 3V, and max input offset voltage of 175000uV. It operates in industrial temperature range (-40 to 85 °C) and is suitable for surface mount applications requiring small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,405 parts In-Stock

1+ parts

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5,405

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Digiode

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

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1,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,122 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

$3.814

10k+ parts

-

2,122

$3.291

-

$3.814

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DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

$3.624

100+ parts

$3.334

1k+ parts

-

10k+ parts

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1,190

$3.624

$3.334

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ChromeModa Solutions

Germany . 2,717 parts In-Stock

1+ parts

$3.698

100+ parts

$3.032

1k+ parts

-

10k+ parts

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2,717

$3.698

$3.032

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IDEA Electronic Components Group

UK . 1,656 parts In-Stock

1+ parts

$3.698

100+ parts

-

1k+ parts

$3.328

10k+ parts

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1,656

$3.698

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$3.328

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One Stop Electronics

USA . 1,226 parts In-Stock

1+ parts

$4.410

100+ parts

-

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10k+ parts

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1,226

$4.410

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$9.837

100+ parts

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283

$9.837

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Corphita

USA . 1,994 parts In-Stock

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1,994

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Overview

Elevate your electronic designs with the TCA4311DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality buffer amplifiers that offer exceptional performance and reliability. Ideal for a variety of applications, this small outline package amplifier provides customers with unmatched value and benefits. Whether you're looking to enhance signal integrity or improve overall system efficiency, the TCA4311DG4 is the perfect solution for your needs. Experience the difference that Texas Instruments can make in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and resistance to external factors, making this buffer amplifier suitable for various environments.

Maximum Input Offset Voltage: 175000 uV

A low maximum input offset voltage ensures accurate and precise signal processing, making this buffer amplifier ideal for applications where precision is important.

Surface Mount: YES

Being surface mountable makes this buffer amplifier easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this buffer amplifier energy-efficient and suitable for low-power applications.

Maximum Supply Voltage Limit: 7 V

With a maximum supply voltage limit of 7V, this buffer amplifier offers flexibility in power supply options while ensuring stable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this buffer amplifier to function reliably even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this buffer amplifier can operate in cold temperature conditions without any issues.

Amplifier Type: BUFFER

Being a buffer amplifier, this product provides impedance matching, signal isolation, and signal amplification capabilities, making it a versatile choice for signal processing applications.

Technical Specifications

Buffer Amplifiers TCA4311DG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Input Offset Voltage Limit:

175 mV

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Output Current:

50 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TCA4311DG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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