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BUF11705AIPWPRG4

Texas Instruments

BUF11705AIPWPRG4 by Texas Instruments

BUF11705AIPWPRG4 by Texas Instruments is a 10-function buffer amplifier with a 1MHz bandwidth and 18V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring high-speed buffering in compact designs. The package style is small outline with a heat sink, ideal for surface mount assembly in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,288 parts In-Stock

1+ parts

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8,288

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Digiode

USA . 2,951 parts In-Stock

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2,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,970 parts In-Stock

1+ parts

$4.520

100+ parts

-

1k+ parts

$4.965

10k+ parts

-

1,970

$4.520

-

$4.965

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ChromeModa Solutions

Germany . 928 parts In-Stock

1+ parts

$5.079

100+ parts

$4.165

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-

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928

$5.079

$4.165

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IDEA Electronic Components Group

UK . 23 parts In-Stock

1+ parts

$5.079

100+ parts

-

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$4.571

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23

$5.079

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$4.571

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One Stop Electronics

USA . 1,022 parts In-Stock

1+ parts

$9.410

100+ parts

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1,022

$9.410

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Native Components

USA . 794 parts In-Stock

1+ parts

$14.330

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794

$14.330

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AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$14.563

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745

$14.563

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Northwest PG Solutions

USA . 574 parts In-Stock

1+ parts

$15.763

100+ parts

$14.187

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574

$15.763

$14.187

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Corphita

USA . 3,159 parts In-Stock

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3,159

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DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

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100+ parts

$4.579

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940

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$4.579

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the BUF11705AIPWPRG4 Buffer Amplifier. This versatile component offers a wide range of applications, providing exceptional performance in various electronic systems. With its advanced technology and durable construction, this amplifier ensures seamless operation and precise signal processing. Trust Texas Instruments to deliver unparalleled value and efficiency, making your projects stand out from the rest. Elevate your designs with the BUF11705AIPWPRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good resistance to heat and ensures durability, making the product reliable for long-term use.

Maximum Input Offset Voltage: 20000 uV

With a maximum input offset voltage of 20000 uV, this buffer amplifier ensures accurate and precise signal processing, making it suitable for high-performance applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 10

This buffer amplifier offers multiple functions in a single package, providing versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 18

Operating at a nominal supply voltage of 18V, this buffer amplifier is suitable for a wide range of applications and offers stable performance.

No. of Terminals: 28

With 28 terminals, this buffer amplifier has a high level of connectivity options, allowing for flexible circuit configurations.

Maximum Supply Voltage Limit: 24 V

The maximum supply voltage limit of 24V ensures safe operation and protects the amplifier from potential damage due to overvoltage.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85°C allows this buffer amplifier to withstand harsh environmental conditions and extended use without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures that this buffer amplifier can function effectively in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Length: 9.7 mm

With a compact length of 9.7mm, this buffer amplifier is suitable for applications where space is limited, without compromising on performance.

Technology: BIPOLAR

Bipolar technology offers high-speed signal processing and low noise performance, making this buffer amplifier ideal for applications requiring precision and efficiency.

Technical Specifications

Buffer Amplifiers BUF11705AIPWPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

10

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1 MHz

Nominal Slew Rate:

1.6 V/us

Input Offset Voltage Limit:

20 mV

Operational Characteristics

Nominal Supply Voltage:

18 V

Maximum Supply Voltage:

24 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.382 in (9.7 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

28

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF11705AIPWPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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