Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
LH0033G-MIL by National Semiconductor is a military-grade buffer amplifier with a max bandwidth of 200 MHz. It operates at temperatures ranging from -55 to 125 °C and has a low bias current of 0.00025 uA. Ideal for applications requiring high-speed signal buffering in harsh environments.
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$6.410
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AZTECH Wire
$7.465
Argo Parts USA
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Corphita
Eliminating Global Boundries, Inc
METAL - Provides durability and reliability in various operating conditions.
15000 uV - Ensures accurate signal processing with minimal error.
0.00025 uA - Maintains stability and efficiency in power consumption.
MIL-STD-883 Class B (Modified) - Guarantees high quality and performance standards.
ROUND - Allows for easy installation and integration into different systems.
15V - Compatible with standard power sources for seamless operation.
+-15V - Offers flexibility in power input requirements.
12 - Provides multiple connection points for enhanced functionality.
CYLINDRICAL - Space-saving design for compact installations.
2000 V/us - Enables fast response time for quick signal amplification.
20V - Safeguards the amplifier from potential overvoltage situations.
125 °C - Allows for reliable operation in high-temperature environments.
0.0025 uA - Maintains low power consumption for efficiency.
55 °C - Suitable for use in extreme cold conditions.
Tin/Lead (Sn/Pb) - Ensures secure and reliable electrical connections.
BOTTOM - Facilitates easy access and connectivity in various setups.
200 MHz - Supports high-frequency signal amplification needs.
MILITARY - Designed to meet rigorous military standards for reliability.
20V - Accommodates dual power supply requirements for enhanced versatility.
FET - Utilizes Field-Effect Transistor technology for efficient signal processing.
WIRE - Allows for easy soldering and connection to other components.
BUFFER - Ideal for providing impedance matching and signal isolation.
22 mA - Handles high current loads with precision and stability.
15V - Supports dual power supply configurations for optimal performance.
2400 V/us - Provides fast and smooth signal processing capabilities.
2.54 mm - Ensures compatibility with standard spacing configurations.
Buffer Amplifiers LH0033G-MIL attributes and parameters. Explore more Buffer Amplifiers devices from National Semiconductor
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JESD-609 Code:
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LH0033G-MIL Amplifiers trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.33.00.01
SB
8542.33.00.00
National Semiconductor was an American semiconductor manufacturer which specialized in analog devices and subsystems, formerly with headquarters in Santa Clara, California. The company produced power management integrated circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. National's key markets included wireless handsets, displays and a variety of broad electronics markets, including medical, automotive, industrial and test and measurement applications.On September 23, 2011, the company formally became part of Texas Instruments as the "Silicon Valley" division.
EU2B-YS3203F
Idec
ROTARY SWITCH;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
Dc Components
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8720AI-CP-TR
Microchip Technology
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LT1010CDD#PBF
Analog Devices
LT1010CDD#PBF by Analog Devices is a buffer amplifier with 800uA max average bias current, 75V/us min slew rate, and 10mA max supply current. It's used in applications requiring high-speed signal buffering and amplification in a compact form factor.
BUF03BJ
BUF03BJ by Analog Devices is a BUFFER amplifier with 50MHz bandwidth, 35000uV max input offset voltage, and 180V/us min slew rate. Ideal for military applications due to its MIL-TEMP rating and cylindrical package style.
OPA682N-3K
OPA682N-3K by Texas Instruments is a buffer amplifier with 7500uV max input offset voltage, 220MHz nominal bandwidth, and 570V/us min slew rate. Ideal for industrial applications requiring high-speed signal buffering in compact spaces due to its small outline package style.
AD8075ARU-REEL
AD8075ARU-REEL by Analog Devices is a Buffer Amplifier with 550 MHz Bandwidth, 40000 uV Max Input Offset Voltage, and 10 uA Max Average Bias Current. Ideal for industrial applications requiring a compact design and high-speed signal processing capabilities.
LH0063CK-T
Maxim Integrated
BUFFER; Temperature Grade: MILITARY; Terminal Form: PIN/PEG; No. of Terminals: 2; Package Code: TO-3; Package Shape: ROUND;
LMH6321MRX
LMH6321MRX by Texas Instruments is a buffer amplifier with a bandwidth of 110 MHz, ideal for automotive applications. It has a max input offset voltage of 52000 uV and operates at temperatures ranging from -40 to 125 °C. With low bias current (17 uA) and small outline package style, it's suitable for compact designs requiring high-speed signal buffering.
MAX470CPE
BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MAX4219EEE
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
OPA2682N
OPA2682N by Texas Instruments is a dual-buffer amplifier with 330MHz bandwidth, 1200V/us slew rate, and 7500uV max input offset voltage. Ideal for industrial applications requiring high-speed signal buffering in a compact package.
LM310PP1
LM310PP1 by Texas Instruments is a buffer amplifier with +-15V power supplies. It has 8 terminals, operates b/w 0-70°C, and uses PLASTIC/EPOXY package material. Ideal for commercial applications requiring a dual-terminal IN-LINE package style with 2.54mm terminal pitch.
MAX405ESA+T
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MAX405ESA
LMC6008IM
LMC6008IM by Texas Instruments is a buffer amplifier with 8 functions, operating at -40 to 85 °C. It has a max input offset voltage of 25000 uV and a min slew rate of 1.7 V/us. Ideal for applications requiring low bias current and high supply voltage up to 16V in compact designs.
BUF03BJ/883
BUF03BJ/883 by Analog Devices is a MIL-STD-883 compliant BUFFER amplifier with 35000 uV max input offset voltage, 180 V/us min slew rate, and 50 MHz nominal bandwidth. Ideal for military applications requiring high precision and reliability in harsh environments.
HOS-100SH
HOS-100SH by Analog Devices is a BUFFER Amplifier with 25000uV Max Input Offset Voltage, 25uA Max Average Bias Current, and 125MHz Nominal Bandwidth. Ideal for MILITARY applications due to its -55 to 125 °C operating temperature range and BIPOLAR technology.
LMV112SD
LMV112SD by Texas Instruments is a buffer amplifier with 2 functions, operating at a nominal voltage of 2.7V and offering a bandwidth of 40MHz. It is designed for industrial applications requiring a compact package style, surface mount capability, and high-speed signal buffering.
EL5221CYZ-T13
Renesas Electronics
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
EL5223CRZ
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
ADA4800ACPZ-R7
ADA4800ACPZ-R7 by Analog Devices is a buffer amplifier with 400 MHz bandwidth, 41000 uV max input offset voltage, and 1.8 mA max supply current. Ideal for industrial applications requiring high-speed signal buffering in compact spaces due to its small outline package and wide temperature range of -40 to 85 °C.
BUF03AJ/883C
BUF03AJ/883C by Analog Devices is a MIL-STD-883 screened BUFFER amplifier with 83MHz bandwidth, 20000uV max input offset voltage, and 220 V/us min slew rate. Ideal for military applications due to its -55 to 125 °C operating temp range and low bias current of 0.0004 uA @25C.
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LH0033CG
National Semiconductor
BUFFER; Temperature Grade: OTHER; Terminal Form: WIRE; No. of Terminals: 12; Package Code: TO-8; Package Shape: ROUND;
LH0033CG by Maxim Integrated is a BUFFER amplifier with 100 MHz bandwidth, 25000 uV max input offset voltage, and 24 mA max supply current. It operates at -25 to 85 °C and is ideal for precision signal buffering in electronic circuits requiring high-speed performance.
Alpha Semiconductor
BUFFER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: SQUARE;
Sipex
Calogic
BUFFER; Temperature Grade: OTHER; Terminal Form: WIRE; No. of Terminals: 12; Package Code: QIP; Package Shape: ROUND;
LH0002H/883
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Body Material: METAL;
LH0033G
BUFFER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: SQUARE;
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 12; Package Code: TO-8; Package Shape: ROUND;
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 12; Package Code: QIP; Package Shape: ROUND;
LH0002H
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-5; Package Shape: ROUND;
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: HYBRID;
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Operating Temperature: 125 Cel;
LH0002H/883B
Bae Systems Plc
LH0002H/883C
BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Terminal Position: BOTTOM;
LH0033ACG
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