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BQ27546YZFR-G1

Texas Instruments

BQ27546YZFR-G1 by Texas Instruments

BQ27546YZFR-G1 by Texas Instruments is a Power Management IC with 15 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.8V to 4.5V and peak reflow temperature of 260°C. This IC is ideal for industrial applications requiring precise power supply management in compact designs.

Median Price

$0.806

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.863

1k+ parts

$0.716

10k+ parts

$0.638

6,000

-

$0.863

$0.716

$0.638

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.750

10k+ parts

-

6,000

-

-

$0.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,024 parts In-Stock

1+ parts

$0.671

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

$0.671

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$1.000

-

-

-

Chip Stock

USA . 78,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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78,500

-

-

-

-

Vyrian

USA . 5,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,893

-

-

-

-

VNN

France . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,809 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

$0.498

3,809

$0.508

-

-

$0.498

Argo Parts USA

USA . 2,508 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

$0.493

2,508

$0.508

-

-

$0.493

Ampacity Inc.

Singapore . 5,582 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

5,582

$0.600

-

-

-

Corphita

USA . 4,340 parts In-Stock

1+ parts

$0.635

100+ parts

-

1k+ parts

-

10k+ parts

-

4,340

$0.635

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.000

-

-

-

Parana Technologies

USA . 1,381 parts In-Stock

1+ parts

$9.130

100+ parts

-

1k+ parts

$9.780

10k+ parts

-

1,381

$9.130

-

$9.780

-

DigiPath Technology Company

USA . 1,052 parts In-Stock

1+ parts

$10.053

100+ parts

-

1k+ parts

-

10k+ parts

-

1,052

$10.053

-

-

-

ChromeModa Solutions

Germany . 4,394 parts In-Stock

1+ parts

$10.258

100+ parts

$8.412

1k+ parts

-

10k+ parts

-

4,394

$10.258

$8.412

-

-

IDEA Electronic Components Group

UK . 884 parts In-Stock

1+ parts

$10.258

100+ parts

$9.745

1k+ parts

$9.232

10k+ parts

-

884

$10.258

$9.745

$9.232

-

AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

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247

$18.000

-

-

-

A-Z Elektronik GmbH

Germany . 11,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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11,985

-

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 3,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,990

-

-

-

-

Overview

Elevate your power management solutions with the BQ27546YZFR-G1 from Texas Instruments. This cutting-edge Power Management IC offers unmatched quality and reliability, thanks to its industry-leading manufacturer. Ideal for a wide range of applications, this product delivers unparalleled value and benefits to customers seeking efficient and precise power management. Experience the advantages of Texas Instruments technology with the BQ27546YZFR-G1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, maximizing functionality in compact designs.

Nominal Supply Voltage (Vsup): 3.6 V

Provides a stable and reliable power source for connected devices, ensuring consistent performance.

No. of Terminals: 15

Offers ample connection options for various components, making it versatile for different applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The advanced package style allows for high-density mounting and improved thermal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for demanding industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand extremely cold temperatures, making it suitable for use in harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB routing and layout, improving overall system efficiency.

Maximum Seated Height: 0.625 mm

The low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width (mm): 1.956 mm

The narrow width enables high-density mounting, saving valuable PCB real estate for other components.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Incorporates advanced power management features for efficient energy usage and reliable power delivery.

Minimum Supply Voltage (Vsup): 2.8 V

Provides a wide supply voltage range, making it compatible with a variety of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product undergoes quick and efficient manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly, ensuring robust solder joints.

Length: 2.61 mm

The compact length allows for space-saving designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous temperature requirements of industrial applications for reliable performance.

Terminal Form: BALL

The ball terminal form offers secure connections and allows for easy rework during the assembly process.

Terminal Pitch: 0.5 mm

The narrow terminal pitch enables high-density mounting and finer routing options on the PCB.

Maximum Supply Voltage (Vsup): 4.5 V

Provides a wide supply voltage range, accommodating a variety of power sources for flexibility in application use.

Technical Specifications

Power Management ICs BQ27546YZFR-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B15

JESD-609 Code:

e1

Length:

2.61 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.956 mm

Trade Compliance

BQ27546YZFR-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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