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BQ27541DRZT-G1

Texas Instruments

BQ27541DRZT-G1 by Texas Instruments

BQ27541DRZT-G1 by Texas Instruments is a power management IC with a nominal voltage of 3.6V and a min operating temperature of -40°C. It is commonly used in industrial applications for power supply management circuits.

Median Price

$4.861

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

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Nova Conductors

Japan . 86 parts In-Stock

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Vyrian

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Digiode

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EMSNET

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Chip Stock

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Bristol Electronics

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Continental Prestige Electronics

USA . 558 parts In-Stock

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$4.861

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$4.764

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Netroflash

USA . 50 parts In-Stock

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$4.861

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$4.764

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Ampacity Inc.

Singapore . 572 parts In-Stock

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$6.500

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One Stop Electronics

USA . 860 parts In-Stock

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AZTECH Wire

Italy . 795 parts In-Stock

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Microchip USA

USA . 234 parts In-Stock

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$15.180

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$14.960

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$14.850

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$14.750

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Parana Technologies

USA . 569 parts In-Stock

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$18.104

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DigiPath Technology Company

USA . 1,529 parts In-Stock

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$19.935

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$18.340

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ChromeModa Solutions

Germany . 5,985 parts In-Stock

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

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Lixinc

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Argo Parts USA

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Perfect Parts

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Overview

Discover the BQ27541DRZT-G1 by Texas Instruments, a high-quality Power Management IC designed to bring unmatched efficiency and reliability to your electronic devices. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers superior performance. Whether you're designing smartphones, tablets, or wearables, the BQ27541DRZT-G1 offers advanced power supply management circuitry that maximizes battery life and ensures optimal charging. Say goodbye to frequent recharging and hello to uninterrupted productivity. Experience the value, benefits, and advantages that this product brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to external factors, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration, saving time and effort during assembly processes. This makes this power management IC suitable for efficient manufacturing.

Package Shape: RECTANGULAR

With a rectangular package shape, this power management IC offers a compact design, making it space-efficient and ideal for applications where size is a constraint.

Nominal Supply Voltage (Vsup): 3.6 V

The specified nominal supply voltage of 3.6 V ensures compatibility with a wide range of power systems, making this IC versatile and ready to use in various devices and systems.

No. of Terminals: 12

The presence of 12 terminals allows for multiple connections and functionalities, enabling this power management IC to handle complex power requirements, increasing its applicability.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This power management IC's small outline, heat sink/slug, and very thin profile package style enhance thermal dissipation efficiency and facilitate space-saving designs, making it an excellent choice for power-sensitive applications.

Maximum Operating Temperature: 85°C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments, making this power management IC suitable for a wide range of industrial applications.

Minimum Operating Temperature: -40°C

Thanks to its ability to operate at temperatures as low as -40°C, this power management IC can handle extreme temperature conditions, making it suitable for both indoor and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish consisting of nickel, palladium, and gold provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and a long product lifespan.

Terminal Position: DUAL

The dual terminal position allows for easy integration and connectivity, enhancing usability and flexibility in various circuit layouts, making this IC compatible with different system designs.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this power management IC offers a low profile, enabling it to fit in compact spaces, making it a viable choice for miniaturized devices.

Width (mm): 2.5 mm

The narrow width of 2.5 mm ensures space-saving integration, making this power management IC suitable for applications with tight board space requirements.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC is capable of efficiently regulating and controlling power flow and distribution, making it an essential component for various electronic devices and systems.

Minimum Supply Voltage (Vsup): 2.7 V

The specified minimum supply voltage of 2.7 V ensures compatibility with lower voltage systems, expanding the range of applications where this power management IC can be utilized.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this power management IC can undergo solder reflow processes with standard lead-free soldering techniques, ensuring easy and reliable assembly during manufacturing.

Length: 4 mm

The compact length of 4 mm allows for space-efficient placement, making this power management IC suitable for miniaturized electronic devices and optimizing board space utilization.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this power management IC can operate reliably in harsh environmental conditions, making it a dependable choice for demanding industrial applications.

Terminal Form: NO LEAD

The terminal form without lead promotes RoHS compliance, minimizing environmental impact, and ensuring compatibility with lead-free manufacturing processes, making this IC a sustainable and eco-friendly option.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density PCB layouts, enabling this power management IC to be used in compact designs, such as portable electronic devices.

Moisture Sensitivity Level (MSL): 2

With an MSL rating of 2, this power management IC has medium sensitivity to moisture, allowing safe storage and handling without the need for special precautions, ensuring convenience during manufacturing and storage processes.

Maximum Supply Voltage (Vsup): 5.5 V

The specified maximum supply voltage of 5.5 V ensures compatibility with higher voltage systems, broadening the range of applications where this power management IC can be employed.

Technical Specifications

Power Management ICs BQ27541DRZT-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

BQ27541DRZT-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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