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BQ27510DRZT-G3

Texas Instruments

BQ27510DRZT-G3 by Texas Instruments

BQ27510DRZT-G3 by Texas Instruments is a Power Management IC with Vsup ranging from 2.7V to 5.5V, ideal for industrial applications. It features 12 terminals, operates b/w -40°C to 85°C, and has a compact rectangular package style. The IC's terminal finish is Nickel/Palladium/Gold (Ni/Pd/Au) with a small outline and very thin profile design.

Median Price

$4.110

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 160 parts In-Stock

1+ parts

$3.560

100+ parts

$2.220

1k+ parts

$1.610

10k+ parts

-

160

$3.560

$2.220

$1.610

-

Newark

USA . 160 parts In-Stock

1+ parts

$4.110

100+ parts

$3.020

1k+ parts

-

10k+ parts

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160

$4.110

$3.020

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-

Element14

Singapore . 160 parts In-Stock

1+ parts

$6.190

100+ parts

$4.550

1k+ parts

$3.270

10k+ parts

-

160

$6.190

$4.550

$3.270

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$3.520

100+ parts

-

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56

$3.520

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Chip Stock

USA . 27,000 parts In-Stock

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27,000

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Vyrian

USA . 7,210 parts In-Stock

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7,210

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Digiode

USA . 3,208 parts In-Stock

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3,208

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VNN

France . 1,974 parts In-Stock

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1,974

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LWI Electronics Inc

India . 240 parts In-Stock

1+ parts

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240

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Sensible Micro Corp

USA . 176 parts In-Stock

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176

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Semi Source

USA . 125 parts In-Stock

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125

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EZ Electronic Parts

Israel . 8 parts In-Stock

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8

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Elcom Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,438 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

-

10k+ parts

$3.450

4,438

$3.520

-

-

$3.450

Argo Parts USA

USA . 543 parts In-Stock

1+ parts

$3.520

100+ parts

-

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543

$3.520

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

$3.344

10k+ parts

$3.274

500

$3.520

-

$3.344

$3.274

One Stop Electronics

USA . 1,454 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,454

$5.500

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-

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Parana Technologies

USA . 891 parts In-Stock

1+ parts

$5.907

100+ parts

-

1k+ parts

$6.693

10k+ parts

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891

$5.907

-

$6.693

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Ampacity Inc.

Singapore . 165 parts In-Stock

1+ parts

$6.500

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165

$6.500

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DigiPath Technology Company

USA . 1,854 parts In-Stock

1+ parts

$6.504

100+ parts

$5.984

1k+ parts

-

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1,854

$6.504

$5.984

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ChromeModa Solutions

Germany . 3,955 parts In-Stock

1+ parts

$6.637

100+ parts

$5.442

1k+ parts

-

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3,955

$6.637

$5.442

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IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$6.637

100+ parts

-

1k+ parts

$5.973

10k+ parts

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557

$6.637

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$5.973

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AZTECH Wire

Italy . 351 parts In-Stock

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$8.417

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351

$8.417

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Corohmni

South Africa . 41 parts In-Stock

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$8.499

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41

$8.499

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Microchip USA

USA . 326 parts In-Stock

1+ parts

$21.860

100+ parts

$21.860

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$21.860

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$21.860

326

$21.860

$21.860

$21.860

$21.860

Lixinc

USA . 11,428 parts In-Stock

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Perfect Parts

USA . 5,313 parts In-Stock

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5,313

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,222 parts In-Stock

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2,222

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Discover the BQ27510DRZT-G3 by Texas Instruments, a top-quality Power Management IC designed to optimize performance and efficiency. With its advanced technology and reliable manufacturer, this product offers unparalleled value and benefits to customers. Ideal for various applications in power supply management circuits, this IC ensures seamless operation even in extreme temperatures. Trust Texas Instruments for cutting-edge solutions that exceed expectations. Elevate your projects with the BQ27510DRZT-G3 and experience unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring a longer lifespan and reliability.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage (Vsup): 3.6 V

Compatible with a wide range of electronic devices powered by typical voltage supplies.

Maximum Operating Temperature: 85 °C

Allows for reliable operation even in high-temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures good electrical conductivity and corrosion resistance for stable performance.

Width (mm): 2.5 mm

Compact size for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.7 V

Ability to operate under lower supply voltages for energy-efficient designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where robustness and reliability are crucial.

Technical Specifications

Power Management ICs BQ27510DRZT-G3 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC12,.16,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

BQ27510DRZT-G3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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