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BQ27542DRZT-G1

Texas Instruments

BQ27542DRZT-G1 by Texas Instruments

BQ27542DRZT-G1 by Texas Instruments is a Power Management IC with 12 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is used in industrial applications for power supply management circuits due to its small outline package style and dual terminal position.

Median Price

$4.630

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 495 parts In-Stock

1+ parts

$4.450

100+ parts

$2.816

1k+ parts

$2.548

10k+ parts

$2.447

495

$4.450

$2.816

$2.548

$2.447

Mouser Electronics

USA . 405 parts In-Stock

1+ parts

$4.810

100+ parts

$3.540

1k+ parts

$2.540

10k+ parts

$2.410

405

$4.810

$3.540

$2.540

$2.410

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$2.839

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$2.839

-

-

-

Digiode

USA . 2,772 parts In-Stock

1+ parts

$4.228

100+ parts

-

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-

10k+ parts

-

2,772

$4.228

-

-

-

Vyrian

USA . 5,226 parts In-Stock

1+ parts

-

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-

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5,226

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-

-

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VNN

France . 3,129 parts In-Stock

1+ parts

-

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3,129

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-

-

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Cyclops Electronics Ltd

UK . 1,574 parts In-Stock

1+ parts

-

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1,574

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-

-

-

Chip Stock

USA . 625 parts In-Stock

1+ parts

-

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-

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625

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,643 parts In-Stock

1+ parts

$2.839

100+ parts

-

1k+ parts

-

10k+ parts

$2.782

5,643

$2.839

-

-

$2.782

Argo Parts USA

USA . 641 parts In-Stock

1+ parts

$2.839

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$2.839

-

-

-

Ampacity Inc.

Singapore . 1,360 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,360

$3.780

-

-

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Corphita

USA . 724 parts In-Stock

1+ parts

$4.005

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$4.005

-

-

-

Parana Technologies

USA . 1,108 parts In-Stock

1+ parts

$13.586

100+ parts

-

1k+ parts

$14.089

10k+ parts

-

1,108

$13.586

-

$14.089

-

DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

$14.960

100+ parts

$13.763

1k+ parts

-

10k+ parts

-

1,977

$14.960

$13.763

-

-

ChromeModa Solutions

Germany . 3,779 parts In-Stock

1+ parts

$15.265

100+ parts

$12.517

1k+ parts

-

10k+ parts

-

3,779

$15.265

$12.517

-

-

IDEA Electronic Components Group

UK . 685 parts In-Stock

1+ parts

$15.265

100+ parts

$14.502

1k+ parts

$13.738

10k+ parts

-

685

$15.265

$14.502

$13.738

-

Microchip USA

USA . 362 parts In-Stock

1+ parts

$21.860

100+ parts

$21.730

1k+ parts

$21.660

10k+ parts

$21.590

362

$21.860

$21.730

$21.660

$21.590

Lixinc

USA . 17,377 parts In-Stock

1+ parts

-

100+ parts

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17,377

-

-

-

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.782

1k+ parts

$2.697

10k+ parts

$2.640

1,000

-

$2.782

$2.697

$2.640

Authorized Procurement Solutions

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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150

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Overview

Looking for a reliable power management solution? Look no further than the BQ27542DRZT-G1 by Texas Instruments. With a reputation for excellence in manufacturing quality ICs, this product offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this Power Management IC ensures optimal performance and efficiency. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Durable and lightweight material for the package body ensures reliable performance and easy handling.

Surface Mount - YES

Allows for easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup) - 3.6 V

Optimal supply voltage for efficient power management and compatibility with a wide range of electronic devices.

Maximum Operating Temperature - 85 °C

Ensures stable performance even under high temperature conditions, suitable for industrial applications.

Maximum Seated Height - 1 mm

Low profile design enables compact and space-saving installations.

Width (mm) - 2.5 mm

Compact width allows for versatile placement within electronic devices and circuit boards.

Minimum Supply Voltage (Vsup) - 2.7 V

Wide operating voltage range provides flexibility and compatibility with various power sources.

Terminal Form - NO LEAD

Lead-free terminal form is environmentally friendly and complies with RoHS regulations, ensuring a sustainable choice.

Moisture Sensitivity Level (MSL) - 2

Moderate moisture sensitivity level indicates robustness against humidity, enhancing reliability and longevity.

Maximum Supply Voltage (Vsup) - 5.5 V

High maximum supply voltage capability allows for versatility in power input options.

Technical Specifications

Power Management ICs BQ27542DRZT-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.131 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

BQ27542DRZT-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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