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BQ27441DRZR-G1A

Texas Instruments

BQ27441DRZR-G1A by Texas Instruments

BQ27441DRZR-G1A by Texas Instruments is a Power Management IC with 12 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.45V to 4.5V and comes in a small outline package suitable for industrial applications requiring precise power supply management circuits.

Median Price

$1.873

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,201 parts In-Stock

1+ parts

$1.420

100+ parts

$0.988

1k+ parts

$0.874

10k+ parts

-

2,201

$1.420

$0.988

$0.874

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Arrow

USA . 55 parts In-Stock

1+ parts

$1.556

100+ parts

$1.113

1k+ parts

-

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55

$1.556

$1.113

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Texas Instruments

USA . 81,719 parts In-Stock

1+ parts

$1.926

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$1.591

1k+ parts

$0.860

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81,719

$1.926

$1.591

$0.860

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DigiKey

USA . 2,933 parts In-Stock

1+ parts

$2.310

100+ parts

$1.402

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$1.237

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$1.158

2,933

$2.310

$1.402

$1.237

$1.158

Mouser Electronics

USA . 6,071 parts In-Stock

1+ parts

$2.610

100+ parts

$1.600

1k+ parts

$1.440

10k+ parts

$1.330

6,071

$2.610

$1.600

$1.440

$1.330

Newark

USA . 1,936 parts In-Stock

1+ parts

$2.900

100+ parts

$2.410

1k+ parts

$2.240

10k+ parts

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1,936

$2.900

$2.410

$2.240

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Element14

Singapore . 1,936 parts In-Stock

1+ parts

-

100+ parts

$1.873

1k+ parts

$1.415

10k+ parts

$1.285

1,936

-

$1.873

$1.415

$1.285

Farnell

UK . 986 parts In-Stock

1+ parts

-

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$1.150

1k+ parts

$1.020

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$1.000

986

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$1.150

$1.020

$1.000

Verical

USA . 55 parts In-Stock

1+ parts

-

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$1.113

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55

-

$1.113

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Distributors (In-Stock)

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Digiode

USA . 4,307 parts In-Stock

1+ parts

$0.978

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$0.978

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Nova Conductors

Japan . 150 parts In-Stock

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$1.400

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$1.400

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Vyrian

USA . 11,661 parts In-Stock

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Cyclops Electronics Ltd

UK . 7,790 parts In-Stock

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VNN

France . 6,100 parts In-Stock

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Classic Components Corporation

USA . 1,010 parts In-Stock

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1,010

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Holdelec - ElecDif-Pro

France . 207 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,281 parts In-Stock

1+ parts

$0.927

100+ parts

-

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4,281

$0.927

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Corohmni

South Africa . 879 parts In-Stock

1+ parts

$1.293

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879

$1.293

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Argo Parts USA

USA . 3,267 parts In-Stock

1+ parts

$1.354

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3,267

$1.354

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Netroflash

USA . 1,000 parts In-Stock

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$1.400

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$1.400

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Ampacity Inc.

Singapore . 11,642 parts In-Stock

1+ parts

$2.020

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$2.020

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Continental Prestige Electronics

USA . 2,585 parts In-Stock

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$2.100

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$2.100

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Microchip USA

USA . 9,185 parts In-Stock

1+ parts

$8.179

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9,185

$8.179

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Parana Technologies

USA . 1,449 parts In-Stock

1+ parts

$15.923

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$16.276

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1,449

$15.923

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$16.276

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DigiPath Technology Company

USA . 1,247 parts In-Stock

1+ parts

$17.533

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$16.131

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1,247

$17.533

$16.131

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IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$17.891

100+ parts

$16.996

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$16.102

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519

$17.891

$16.996

$16.102

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ChromeModa Solutions

Germany . 208 parts In-Stock

1+ parts

$17.891

100+ parts

$14.671

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208

$17.891

$14.671

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S.R.D Solutions

India . 74,500 parts In-Stock

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Perfect Parts

USA . 31,219 parts In-Stock

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GreenTree Electronics

Israel . 17,082 parts In-Stock

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Lixinc

USA . 16,125 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,711 parts In-Stock

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Metaverse IC Inc.

Canada . 12,203 parts In-Stock

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Epart123

USA . 9,000 parts In-Stock

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$0.830

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$0.830

9,000

-

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$0.830

$0.830

A-Z Elektronik GmbH

Germany . 7,592 parts In-Stock

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7,592

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Authorized Procurement Solutions

USA . 5,610 parts In-Stock

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5,610

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Alle Elektronik GmbH

Germany . 4,261 parts In-Stock

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4,261

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Overview

Discover the cutting-edge BQ27441DRZR-G1A by Texas Instruments, a top-tier Power Management IC that guarantees reliability and efficiency. With a durable plastic/epoxy body and advanced features like a nominal supply voltage of 3.6V, this product is ideal for a wide range of applications. Whether you're looking to enhance battery performance or optimize power consumption, this small outline, heat sink design offers unparalleled value. Trust Texas Instruments for innovative solutions that deliver superior performance, making your projects stand out in the competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Compact shape saves space on the circuit board, optimizing layout design.

Nominal Supply Voltage (Vsup): 3.6 V

Ideal operating voltage for efficient power management and stability.

No. of Terminals: 12

Sufficient number of terminals for connecting various components without overcrowding.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Efficient heat dissipation and slim profile for compact devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high-temperature conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of environments, from industrial to automotive.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for long-lasting connections.

Terminal Position: DUAL

Allows for flexible placement on the circuit board for optimal performance.

Maximum Seated Height: 1 mm

Low profile design for space-saving applications.

Width (mm): 2.5 mm

Compact width for efficient use of board space.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Versatile functionality for power management applications.

Minimum Supply Voltage (Vsup): 2.45 V

Allows for operation in low voltage scenarios for versatile applications.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes for easy assembly.

Length: 4 mm

Optimal length for compatibility with standard board sizes.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature ranges.

Terminal Form: NO LEAD

Environmentally friendly lead-free terminal form.

Terminal Pitch: 0.4 mm

Fine pitch for precise connections in compact spaces.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for reliable performance in various conditions.

Maximum Supply Voltage (Vsup): 4.5 V

Handles higher voltage inputs for enhanced flexibility in power management.

Technical Specifications

Power Management ICs BQ27441DRZR-G1A attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.45 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

BQ27441DRZR-G1A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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