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BQ27541DRZT

Texas Instruments

BQ27541DRZT by Texas Instruments

BQ27541DRZT by Texas Instruments is a power management IC with a nominal voltage of 3.6V and a min operating temperature of -40°C. It is commonly used in industrial applications for power supply support circuits.

Median Price

$4.840

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,474 parts In-Stock

1+ parts

-

100+ parts

$4.840

1k+ parts

-

10k+ parts

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4,474

-

$4.840

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Rochester

USA . 3,974 parts In-Stock

1+ parts

-

100+ parts

$4.430

1k+ parts

$3.960

10k+ parts

$3.730

3,974

-

$4.430

$3.960

$3.730

Verical

USA . 1,544 parts In-Stock

1+ parts

-

100+ parts

$5.537

1k+ parts

$4.950

10k+ parts

$4.662

1,544

-

$5.537

$4.950

$4.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.666

100+ parts

-

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10

$4.666

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Digiode

USA . 2,865 parts In-Stock

1+ parts

$4.674

100+ parts

-

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2,865

$4.674

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Vyrian

USA . 4,178 parts In-Stock

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4,178

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VNN

France . 3,498 parts In-Stock

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3,498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,402 parts In-Stock

1+ parts

$2.649

100+ parts

-

1k+ parts

$2.543

10k+ parts

$2.543

4,402

$2.649

-

$2.543

$2.543

Ampacity Inc.

Singapore . 3,983 parts In-Stock

1+ parts

$4.180

100+ parts

-

1k+ parts

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3,983

$4.180

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Corphita

USA . 555 parts In-Stock

1+ parts

$4.428

100+ parts

-

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555

$4.428

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Bastille Electronics

Australia . 2,597 parts In-Stock

1+ parts

$4.666

100+ parts

$4.433

1k+ parts

$4.211

10k+ parts

$4.153

2,597

$4.666

$4.433

$4.211

$4.153

Continental Prestige Electronics

USA . 6,108 parts In-Stock

1+ parts

$4.666

100+ parts

-

1k+ parts

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10k+ parts

$4.573

6,108

$4.666

-

-

$4.573

Parana Technologies

USA . 1,051 parts In-Stock

1+ parts

$5.878

100+ parts

-

1k+ parts

$6.662

10k+ parts

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1,051

$5.878

-

$6.662

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DigiPath Technology Company

USA . 1,956 parts In-Stock

1+ parts

$6.472

100+ parts

-

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1,956

$6.472

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ChromeModa Solutions

Germany . 4,479 parts In-Stock

1+ parts

$6.604

100+ parts

$5.415

1k+ parts

-

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4,479

$6.604

$5.415

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$6.604

100+ parts

-

1k+ parts

$5.944

10k+ parts

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1,457

$6.604

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$5.944

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A-Z Elektronik GmbH

Germany . 7,482 parts In-Stock

1+ parts

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7,482

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Alle Elektronik GmbH

Germany . 4,988 parts In-Stock

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4,988

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Argo Parts USA

USA . 3,527 parts In-Stock

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3,527

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Perfect Parts

USA . 1,122 parts In-Stock

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1,122

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Kepictronics

USA . 284 parts In-Stock

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284

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Cyclops Electronics Ltd (Excess)

UK . 176 parts In-Stock

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176

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Overview

Discover the BQ27541DRZT by Texas Instruments, a top-quality Power Management IC that is revolutionizing the industry. With its advanced manufacturing techniques and innovative design, Texas Instruments has created a product that guarantees reliability and performance. This IC is perfect for various applications, providing efficient power supply support and ensuring optimal functionality. Experience the value and benefits of this small outline, heat sink/slub, very thin profile device that offers stability in a wide range of temperatures. Don't miss out on the advantages that the BQ27541DRZT brings to your projects - it's time to take your power management to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and resistance to heat and moisture, making this power management IC suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, reducing manufacturing time and costs.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard board layouts, ensuring compatibility and easy integration into existing designs.

Nominal Supply Voltage (Vsup): 3.6 V

With a stable nominal supply voltage of 3.6 V, this power management IC ensures reliable and efficient power regulation, making it ideal for a wide range of applications.

No. of Terminals: 12

The 12 terminals provide ample connectivity options, enabling connections to various components and systems, enhancing versatility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for efficient heat dissipation and space-saving characteristics, making it suitable for compact and power-intensive applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can handle high-temperature environments, ensuring reliable performance and durability.

Minimum Operating Temperature: -40 °C

The capability to operate in temperatures as low as -40°C makes this power management IC suitable for harsh environments and extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient mounting options, offering versatility in various circuit board layouts.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this power management IC offers a low-profile design, facilitating space-constrained applications and providing ease of integration.

Width (mm): 2.5 mm

The compact width of 2.5 mm ensures minimal board space usage, enabling efficient and compact designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC serves as a power supply support circuit, providing essential functions to regulate and control power delivery to other components, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 2.7 V

With a minimum supply voltage of 2.7 V, this power management IC offers a wide input voltage range, accommodating various power source configurations.

Maximum Time At Peak Reflow Temperature (s): 30

This power management IC can withstand peak reflow temperature for up to 30 seconds, ensuring easy manufacturing and soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance up to 260°C ensures compatibility with standard manufacturing processes, providing ease of integration and high yield rates.

Length: 4 mm

The compact length of 4 mm allows for space-efficient placement on circuit boards, enabling design flexibility and optimization.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this power management IC meets the temperature and durability requirements for demanding operating conditions, making it a reliable choice.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces environmental impact, offering a lead-free solution.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this power management IC offers fine-pitch soldering compatibility, enabling high-density circuit placement and miniaturization.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this power management IC can handle moderate moisture exposure during manufacturing and storage, ensuring reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for compatibility with a wide range of power sources, providing flexibility and versatility in various applications.

Technical Specifications

Power Management ICs BQ27541DRZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

BQ27541DRZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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