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74GTLPH306DGVRE4

Texas Instruments

74GTLPH306DGVRE4 by Texas Instruments

74GTLPH306DGVRE4 by Texas Instruments is an 8-bit bus driver with GTL/P & LVTTL translation. It operates at a nominal voltage of 3.3V, has a propagation delay of 7.5ns, and features a small outline package style. Ideal for industrial applications requiring bidirectional control with true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,017 parts In-Stock

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Digiode

USA . 3,154 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 402 parts In-Stock

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$5.972

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402

$5.972

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Parana Technologies

USA . 772 parts In-Stock

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$11.975

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$12.381

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772

$11.975

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$12.381

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DigiPath Technology Company

USA . 485 parts In-Stock

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$13.186

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$12.131

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485

$13.186

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ChromeModa Solutions

Germany . 4,242 parts In-Stock

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$13.455

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$11.033

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$13.455

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IDEA Electronic Components Group

UK . 874 parts In-Stock

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$13.455

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$12.782

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$12.110

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874

$13.455

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$12.110

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AZTECH Wire

Italy . 356 parts In-Stock

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$13.789

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$13.789

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One Stop Electronics

USA . 142 parts In-Stock

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$45.000

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Andel Nordic

Denmark . 396 parts In-Stock

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$69.206

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$66.437

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$66.437

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$66.437

Microchip USA

USA . 2,831 parts In-Stock

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Northwest PG Solutions

USA . 1,788 parts In-Stock

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Corphita

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Overview

Experience the seamless performance and reliability of Texas Instruments with the 74GTLPH306DGVRE4 Bus Driver & Transceiver. Designed for industrial applications, this versatile component offers efficient translation capabilities with a nominal supply voltage of 3.3V. With a compact package style and advanced CMOS technology, this product ensures optimal functionality in a variety of settings. Trust in Texas Instruments to deliver superior quality and innovation for all your bus driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast data transmission, making the product efficient for real-time applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Bits: 8

8-bit capability provides sufficient data transmission capacity for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Stable nominal supply voltage ensures consistent performance and reliability of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial environments with varying temperature conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control over the data transmission, enhancing the versatility of the product.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74GTLPH306DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTL/P & LVTTL

Width:

4.4 mm

Trade Compliance

74GTLPH306DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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