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74GTLP2033DGVRG4

Texas Instruments

74GTLP2033DGVRG4 by Texas Instruments

74GTLP2033DGVRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.4 ns at 3.3V, suitable for GTL/P & LVTTL translation applications. It features open-drain/3-state output characteristics, operates b/w -40 to 85°C, and has a small outline package style with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,433 parts In-Stock

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Digiode

USA . 2,678 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 592 parts In-Stock

1+ parts

$2.511

100+ parts

-

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$2.410

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$2.410

592

$2.511

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$2.410

$2.410

AZTECH Wire

Italy . 852 parts In-Stock

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$5.401

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$5.401

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Parana Technologies

USA . 2,326 parts In-Stock

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$23.416

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$24.048

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2,326

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$24.048

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DigiPath Technology Company

USA . 475 parts In-Stock

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$25.784

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$23.721

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475

$25.784

$23.721

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ChromeModa Solutions

Germany . 6,972 parts In-Stock

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$26.310

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$21.574

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6,972

$26.310

$21.574

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IDEA Electronic Components Group

UK . 569 parts In-Stock

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$26.310

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$24.994

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$23.679

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569

$26.310

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$23.679

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One Stop Electronics

USA . 603 parts In-Stock

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$37.000

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Microchip USA

USA . 5,692 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,489 parts In-Stock

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Corphita

USA . 1,726 parts In-Stock

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Northwest PG Solutions

USA . 1,636 parts In-Stock

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Native Components

USA . 670 parts In-Stock

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Overview

Upgrade your electronic designs with the high-quality 74GTLP2033DGVRG4 bus driver & transceiver by Texas Instruments. Trusted by professionals worldwide, Texas Instruments delivers top-notch products that exceed industry standards. This versatile chip translates GTL/P & LVTTL signals with precision, offering a nominal supply voltage of 3.3V and a fast propagation delay of 7.4 ns. Ideal for a wide range of applications, this compact and reliable component ensures optimal performance and seamless integration. Elevate your projects with Texas Instruments' innovative solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 7.4 ns

Low propagation delay ensures fast data transmission and efficient performance.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

No. of Bits: 8

Suitable for handling data transmission involving 8 bits, making it compatible with a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates on a common supply voltage, making it compatible with other components in the system.

Terminal Position: DUAL

Dual terminal position provides flexibility in the connection options, allowing for versatile integration into different systems.

Maximum Seated Height: 1.2 mm

Low seated height helps in compact designs and saves space within the electronic device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74GTLP2033DGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G48

Length:

9.7 mm

Maximum I (ol):

100 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN/3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.4 ns

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74GTLP2033DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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