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74GTL16923DGGRE4

Texas Instruments

74GTL16923DGGRE4 by Texas Instruments

74GTL16923DGGRE4 by Texas Instruments is a Bus Driver & Transceiver with 6.3 ns Propagation Delay, suitable for GTL/P & LVTTL translation. It features a 3-STATE Output and operates at temperatures ranging from -40 to 85 °C, making it ideal for industrial applications requiring bidirectional control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,722 parts In-Stock

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Digiode

USA . 4,768 parts In-Stock

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4,768

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 487 parts In-Stock

1+ parts

$0.491

100+ parts

-

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$0.471

487

$0.491

-

-

$0.471

Northwest PG Solutions

USA . 314 parts In-Stock

1+ parts

$0.540

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-

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$0.476

314

$0.540

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$0.476

Andel Nordic

Denmark . 519 parts In-Stock

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$3.387

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-

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$3.252

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$3.252

519

$3.387

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$3.252

$3.252

AZTECH Wire

Italy . 232 parts In-Stock

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$5.123

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232

$5.123

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Parana Technologies

USA . 827 parts In-Stock

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$11.922

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$12.326

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827

$11.922

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$12.326

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ChromeModa Solutions

Germany . 2,227 parts In-Stock

1+ parts

$13.395

100+ parts

$10.984

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2,227

$13.395

$10.984

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$13.395

100+ parts

$12.725

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$12.056

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1,473

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$12.056

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One Stop Electronics

USA . 1,317 parts In-Stock

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$57.000

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Corphita

USA . 3,374 parts In-Stock

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3,374

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DigiPath Technology Company

USA . 1,119 parts In-Stock

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$12.077

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$12.077

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Microchip USA

USA . 121 parts In-Stock

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Overview

Elevate your electronic designs with the 74GTL16923DGGRE4 by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge solutions. This bus driver & transceiver offers unrivaled quality and reliability, making it a versatile choice for a wide range of applications. From industrial automation to consumer electronics, this product provides seamless translation between GTL/P & LVTTL, ensuring optimal performance. With a nominal supply voltage of 3.3V and advanced features like 3-STATE output characteristics, this component guarantees efficiency and precision in every project. Upgrade your systems today with the 74GTL16923DGGRE4 and experience the unparalleled value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing the overall weight of the product, making it easier to handle and install.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay ensures quick data transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and enhancing durability.

Nominal Supply Voltage: 3.3V

Operates at a standard voltage level, ensuring compatibility with other components in the system.

Maximum Operating Temperature: 85°C

Can withstand high temperatures, making it suitable for industrial applications where heat resistance is required.

Width: 6.1 mm

Compact size allows for efficient use of space on the PCB, especially in applications with limited area available.

Technology: BICMOS

Utilizes BiCMOS technology, offering a combination of high-speed performance and low power consumption for efficient operation.

Technical Specifications

Bus Driver & Transceivers 74GTL16923DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Maximum I (ol):

50 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTL16923DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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