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74GTL16616DGGRG4

Texas Instruments

74GTL16616DGGRG4 by Texas Instruments

74GTL16616DGGRG4 by Texas Instruments is a Bus Driver & Transceiver with 17 bits, operating at 3.3V and translating GTL & LVTTL signals. It features a propagation delay of 6.7ns, outputting in TRUE polarity with a max I (ol) of 64A. Ideal for industrial applications requiring bidirectional control with positive edge triggering.

Median Price

-

Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,159 parts In-Stock

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Digiode

USA . 1,829 parts In-Stock

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Sea View Technologies

USA . 855 parts In-Stock

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Bristol Electronics

USA . 855 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 589 parts In-Stock

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$6.335

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$6.081

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$6.081

589

$6.335

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$6.081

$6.081

AZTECH Wire

Italy . 869 parts In-Stock

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$18.427

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$18.427

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Parana Technologies

USA . 759 parts In-Stock

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$28.396

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$2,637.031

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$25.557

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759

$28.396

$2,637.031

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DigiPath Technology Company

USA . 1,210 parts In-Stock

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$31.268

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$28.766

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$31.268

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ChromeModa Solutions

Germany . 4,936 parts In-Stock

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$31.906

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$26.163

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IDEA Electronic Components Group

UK . 1,376 parts In-Stock

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$31.906

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$30.311

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$28.715

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One Stop Electronics

USA . 737 parts In-Stock

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$61.000

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Northwest PG Solutions

USA . 1,812 parts In-Stock

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Corphita

USA . 749 parts In-Stock

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Native Components

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Overview

Enhance your electronic designs with the high-quality 74GTL16616DGGRG4 by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver offers reliable performance and precise translation between GTL & LVTTL levels, making it ideal for a wide range of applications. With its compact design and advanced features, this product provides exceptional value, efficiency, and functionality to meet all your circuitry needs. Upgrade your projects today with Texas Instruments' innovative technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for rough handling and extended use.

Propagation Delay At Nominal Supply: 6.7 ns

Low propagation delay ensures fast and efficient signal transmission, making the product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product suitable for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with a wide range of electronic systems, making it a versatile choice for various applications.

Maximum I (ol): 64 Amp

High output current capability allows the product to drive demanding loads, making it suitable for power-intensive applications.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission, reducing the risk of errors in data communication.

Technical Specifications

Bus Driver & Transceivers 74GTL16616DGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TRANSLATES BETWEEN GTL/GTL+ SIGNAL LEVELS AND LVTTL LOGIC LEVELS

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

17

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTL16616DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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