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74GTL16622ADGGRG4

Texas Instruments

74GTL16622ADGGRG4 by Texas Instruments

74GTL16622ADGGRG4 by Texas Instruments is a Bus Driver & Transceiver with 5.7ns Propagation Delay, suitable for GTL/P & LVTTL translation. It operates at a Nominal Voltage of 3.3V and features a 64-terminal package style, making it ideal for industrial applications requiring bidirectional control with independent control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,109 parts In-Stock

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Digiode

USA . 2,764 parts In-Stock

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2,764

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Distributors (Availability)

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Native Components

USA . 826 parts In-Stock

1+ parts

$1.767

100+ parts

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826

$1.767

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Northwest PG Solutions

USA . 1,492 parts In-Stock

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$1.944

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1,492

$1.944

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AZTECH Wire

Italy . 687 parts In-Stock

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$12.802

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687

$12.802

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Parana Technologies

USA . 985 parts In-Stock

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$18.222

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$18.359

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985

$18.222

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$18.359

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DigiPath Technology Company

USA . 1,921 parts In-Stock

1+ parts

$20.065

100+ parts

$18.459

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1,921

$20.065

$18.459

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ChromeModa Solutions

Germany . 5,245 parts In-Stock

1+ parts

$20.474

100+ parts

$16.789

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5,245

$20.474

$16.789

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IDEA Electronic Components Group

UK . 1,440 parts In-Stock

1+ parts

$20.474

100+ parts

$19.450

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$18.427

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1,440

$20.474

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$18.427

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Andel Nordic

Denmark . 336 parts In-Stock

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$41.126

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$39.481

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$39.481

336

$41.126

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$39.481

$39.481

One Stop Electronics

USA . 622 parts In-Stock

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$65.000

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622

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Corphita

USA . 1,487 parts In-Stock

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Overview

Enhance your electronic designs with the reliable 74GTL16622ADGGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and performance. This bus driver & transceiver is perfect for a wide range of applications, providing seamless translation between GTL/P & LVTTL signals. With a compact design and advanced features like 3-STATE output characteristics, this product offers superior value and efficiency. Elevate your projects with the precision and innovation that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the bus driver & transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 5.7 ns

Low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed bus communication systems.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the bus driver & transceivers onto PCBs, saving time and effort during assembly.

No. of Functions: 2

Having 2 functions in one device offers added flexibility and functionality, making the product versatile for various applications.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, allowing for space-saving integration within electronic devices.

No. of Bits: 9

With 9 bits, the bus driver & transceivers can handle a large amount of data, suitable for demanding communication requirements.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making integration seamless.

Output Characteristics: 3-STATE

3-STATE output allows the bus driver & transceivers to control bus lines effectively, enabling bus sharing and minimizing conflicts in multi-master systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40°C to 85°C) ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technology: BICMOS

BICMOS technology combines the advantages of CMOS and bipolar technologies, offering high speed and low power consumption for efficient performance.

Technical Specifications

Bus Driver & Transceivers 74GTL16622ADGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Maximum I (ol):

50 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTL16622ADGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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