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74GTLP1394RGYRG4

Texas Instruments

74GTLP1394RGYRG4 by Texas Instruments

74GTLP1394RGYRG4 by Texas Instruments is a bus driver with 9ns propagation delay at 3.3V, suitable for GTLP & LVTTL translation. This chip carrier has 16 terminals, operates in industrial temperature range (-40 to 85 °C), and offers configurable output polarity for various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,185 parts In-Stock

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Digiode

USA . 914 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

$9.818

100+ parts

$911.795

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$8.837

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1,246

$9.818

$911.795

$8.837

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One Stop Electronics

USA . 895 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 796 parts In-Stock

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$10.735

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DigiPath Technology Company

USA . 584 parts In-Stock

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$10.811

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ChromeModa Solutions

Germany . 3,410 parts In-Stock

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$11.032

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$9.046

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$11.032

$9.046

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IDEA Electronic Components Group

UK . 144 parts In-Stock

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$11.032

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$10.480

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$9.929

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144

$11.032

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$9.929

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Andel Nordic

Denmark . 243 parts In-Stock

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$36.046

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$34.605

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$34.605

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$34.605

QUARKTWIN TECHNOLOGY LTD

USA . 26,083 parts In-Stock

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Corphita

USA . 4,232 parts In-Stock

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Northwest PG Solutions

USA . 1,702 parts In-Stock

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Native Components

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the Texas Instruments 74GTLP1394RGYRG4 Bus Driver & Transceivers. Manufactured by a trusted industry leader, this product offers unmatched quality and reliability. Ideal for a variety of applications, this versatile component provides seamless translation between GTLP and LVTTL, ensuring smooth operation at a nominal supply voltage of 3.3V. With quick propagation delay and configurable output polarity, this chip carrier with a very thin profile is the perfect solution for your industrial needs. Upgrade your systems today and experience the superior value and benefits this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay provides fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of systems and power sources.

Output Characteristics: 3-STATE

3-state output allows for the bus driver & transceivers to effectively control bus lines by driving them to a high, low, or high-impedance state, enhancing flexibility in data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver & transceivers energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74GTLP1394RGYRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PQCC-N16

Length:

4 mm

Logic IC Type:

Maximum I (ol):

100 Amp

No. of Bits:

2

No. of Functions:

1

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTLP & LVTTL

Width:

3.5 mm

Trade Compliance

74GTLP1394RGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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