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74GTLP2034DGGRG4

Texas Instruments

74GTLP2034DGGRG4 by Texas Instruments

74GTLP2034DGGRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.1 ns at 3.3V, suitable for GTLP & LVTTL translation applications. It features a small outline package style, open-drain/3-state output characteristics, and operates in industrial temperature grades from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,856 parts In-Stock

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6,856

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Digiode

USA . 4,135 parts In-Stock

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4,135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 152 parts In-Stock

1+ parts

$4.128

100+ parts

-

1k+ parts

$3.962

10k+ parts

$3.962

152

$4.128

-

$3.962

$3.962

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$11.177

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429

$11.177

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Parana Technologies

USA . 213 parts In-Stock

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$16.118

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$16.446

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213

$16.118

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$16.446

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DigiPath Technology Company

USA . 1,782 parts In-Stock

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$17.748

100+ parts

$16.328

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1,782

$17.748

$16.328

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IDEA Electronic Components Group

UK . 2,098 parts In-Stock

1+ parts

$18.110

100+ parts

$17.204

1k+ parts

$16.299

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2,098

$18.110

$17.204

$16.299

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ChromeModa Solutions

Germany . 975 parts In-Stock

1+ parts

$18.110

100+ parts

$14.850

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975

$18.110

$14.850

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One Stop Electronics

USA . 693 parts In-Stock

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$25.000

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693

$25.000

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Native Components

USA . 331 parts In-Stock

1+ parts

$274.938

100+ parts

$269.439

1k+ parts

$266.689

10k+ parts

$263.940

331

$274.938

$269.439

$266.689

$263.940

Northwest PG Solutions

USA . 1,313 parts In-Stock

1+ parts

$302.431

100+ parts

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1,313

$302.431

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Corphita

USA . 4,556 parts In-Stock

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Microchip USA

USA . 154 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the 74GTLP2034DGGRG4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. From industrial automation to telecommunications, this versatile component is designed to enhance performance and efficiency in a wide range of applications. Experience the value of faster propagation delays, flexible trigger types, and true output polarity, all in a compact package that delivers maximum impact. Trust Texas Instruments to deliver cutting-edge technology that brings your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability and ease of handling.

Propagation Delay At Nominal Supply: 7.1 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, reducing assembly time and cost.

Package Shape: RECTANGULAR

Rectangular shape provides compact form factor, saving space on the PCB and allowing for efficient layout design.

No. of Bits: 8

8-bit compatibility makes this product suitable for applications requiring data transfer in 8-bit chunks.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of electronic systems.

Power Supplies (V): 3.3

Consistent power supply voltage of 3.3V ensures stable performance and compatibility with various devices.

No. of Terminals: 48

High number of terminals enable versatile connectivity options and compatibility with different circuit configurations.

Maximum I (ol): 100 Amp

High output current capability of 100Amp allows for driving of multiple loads without external amplification.

Propagation Delay (tpd): 8.6 ns

Low propagation delay ensures minimal signal latency, enabling fast and responsive communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C ensures reliable performance in various environmental conditions.

Output Characteristics: OPEN-DRAIN/3-STATE

Open-drain and 3-state output options provide flexibility in driving different types of loads and managing bus contention.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing and synchronization in data transmission and processing.

Minimum Operating Temperature: -40 °C

Operational at low temperatures down to -40°C, making it suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal position allows for easy installation and connection in various circuit layouts.

No. of Ports: 2

Dual ports enable simultaneous data transfer and communication with multiple devices, increasing overall system efficiency.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm enables compact and space-saving PCB design.

Width: 6.1 mm

Narrow width of 6.1mm facilitates tight PCB layout and integration in constrained spaces.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with standard CMOS logic levels.

Minimum Supply Voltage (Vsup): 3.15 V

Low minimum supply voltage of 3.15V allows for operation in low power consumption applications.

Length: 12.5 mm

Compact length of 12.5mm helps in space-efficient PCB design and layout.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and easy PCB mounting.

Packing Method: TR

TR packing method ensures convenient handling and storage of the product in tape and reel format.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density PCB layout and integration of multiple components.

Count Direction: BIDIRECTIONAL

Bidirectional counting direction enables versatile data communication and processing capabilities.

Control Type: INDEPENDENT CONTROL

Independent control capability allows for flexible operation and customization of the product depending on application requirements.

Maximum Supply Voltage (Vsup): 3.45 V

Maximum supply voltage of 3.45V ensures safe operation within specified limits, protecting the product from overvoltage conditions.

Maximum Power Supply Current (ICC): 40 mA

Low power supply current requirement of 40mA helps in reducing overall power consumption and heat dissipation.

Technical Specifications

Bus Driver & Transceivers 74GTLP2034DGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

Maximum I (ol):

100 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN/3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

7.1 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTLP & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTLP2034DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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