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74ABT162501DLRG4

Texas Instruments

74ABT162501DLRG4 by Texas Instruments

74ABT162501DLRG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 5.7 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85°C) and has independent control for bidirectional data transmission applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,364 parts In-Stock

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Digiode

USA . 2,027 parts In-Stock

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2,027

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Distributors (Availability)

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Andel Nordic

Denmark . 592 parts In-Stock

1+ parts

$4.256

100+ parts

-

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$4.085

10k+ parts

$4.085

592

$4.256

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$4.085

$4.085

Native Components

USA . 867 parts In-Stock

1+ parts

$5.810

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867

$5.810

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AZTECH Wire

Italy . 450 parts In-Stock

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$17.350

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450

$17.350

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Parana Technologies

USA . 1,008 parts In-Stock

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$22.855

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$23.516

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$22.855

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$23.516

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DigiPath Technology Company

USA . 1,628 parts In-Stock

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$25.166

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1,628

$25.166

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ChromeModa Solutions

Germany . 3,236 parts In-Stock

1+ parts

$25.680

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$21.058

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3,236

$25.680

$21.058

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IDEA Electronic Components Group

UK . 507 parts In-Stock

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$25.680

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$24.396

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$23.112

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507

$25.680

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$23.112

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One Stop Electronics

USA . 999 parts In-Stock

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$26.000

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$26.000

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Corphita

USA . 4,558 parts In-Stock

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Northwest PG Solutions

USA . 651 parts In-Stock

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$5.694

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Microchip USA

USA . 144 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 74ABT162501DLRG4, a top-of-the-line Bus Driver & Transceiver perfect for a wide range of applications. With a focus on precision engineering and cutting-edge technology, Texas Instruments ensures that this product delivers exceptional performance every time. Whether you're looking to streamline data transmission or enhance connectivity in your projects, this versatile component offers unmatched value, efficiency, and convenience. Trust Texas Instruments to provide innovative solutions that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 5.7 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the assembly process.

No. of Bits: 18

With 18 bits, this bus driver & transceiver can handle a significant amount of data, making it suitable for complex systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many existing systems and power sources.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and performance of the bus driver & transceiver.

No. of Terminals: 56

Having 56 terminals allows for versatile connectivity options, enabling integration with a wide range of devices and peripherals.

Maximum I (ol): 64 Amp

High output current capability of 64Amp enables driving of heavy loads, enhancing the versatility and applicability of this product.

Propagation Delay (tpd): 5.5 ns

Low propagation delay of 5.5 ns ensures quick response times, critical for real-time communication and data transfer.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and extended use.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor provides flexibility in controlling the output signals, enhancing the versatility of this bus driver & transceiver.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise timing control, essential for synchronous communication and data processing.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable operation in cold environments or during temperature fluctuations.

Terminal Position: DUAL

Dual terminal positions offer convenient installation options and compatibility with various PCB layouts and designs.

No. of Ports: 2

Having 2 ports enables simultaneous communication with multiple devices, enhancing the connectivity and functionality of this product.

Maximum Seated Height: 2.79 mm

Low maximum seated height of 2.79mm minimizes the space required for installation, suitable for compact or densely packed systems.

Width: 7.49 mm

Narrow width of 7.49mm allows for efficient use of PCB space, making this bus driver & transceiver suitable for space-constrained applications.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, crucial for error-free data transmission and processing.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V allows for flexibility in power source selection and compatibility with low-power systems.

Length: 18.415 mm

Compact length of 18.415mm facilitates easy integration and placement within electronic systems, reducing overall footprint.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding environments, making this product suitable for industrial applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and easy soldering during assembly, ensuring robust and reliable performance.

Packing Method: TR

TR packing method offers convenient handling and storage of multiple units, suitable for high-volume production and distribution.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635mm allows for precise connections and compact PCB layouts, essential for high-density electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enables seamless data transfer in both directions, enhancing the versatility and compatibility of this product.

Control Type: INDEPENDENT CONTROL

Independent control capability provides flexibility in managing output signals and data transmission, suitable for custom applications and configurations.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and systems, offering versatility in deployment.

Maximum Power Supply Current (ICC): 36 mA

With a maximum power supply current of 36mA, this product operates efficiently and conserves power, suitable for low-power or battery-powered devices.

Technical Specifications

Bus Driver & Transceivers 74ABT162501DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Maximum I (ol):

64 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74ABT162501DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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