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54AC11251FK

Texas Instruments

54AC11251FK by Texas Instruments

The Texas Instruments 54AC11251FK is an 8-input multiplexer with a supply voltage of 3.3/5V and a load capacitance of 50pF. It features a propagation delay of 7.5ns, operates in temperatures ranging from -55 to 125°C, and has a max seated height of 2.03mm. This CMOS technology chip carrier is suitable for military-grade applications requiring high-speed signal switching capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,603 parts In-Stock

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Digiode

USA . 1,998 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 583 parts In-Stock

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$8.147

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$8.147

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Parana Technologies

USA . 738 parts In-Stock

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$16.099

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$16.429

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738

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$17.727

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ChromeModa Solutions

Germany . 4,319 parts In-Stock

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$18.089

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$14.833

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$14.833

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IDEA Electronic Components Group

UK . 714 parts In-Stock

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$18.089

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$17.185

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$16.280

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714

$18.089

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$16.280

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One Stop Electronics

USA . 1,597 parts In-Stock

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$53.000

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Corphita

USA . 2,745 parts In-Stock

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Northwest PG Solutions

USA . 966 parts In-Stock

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Native Components

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Overview

Unleash the power of versatility with the 54AC11251FK by Texas Instruments, a top-of-the-line Multiplexer & Demultiplexer designed to meet your every need. Crafted with precision and expertise by Texas Instruments, this innovative product offers unrivaled quality and reliability. Perfect for a wide range of applications, this chip carrier package guarantees seamless performance and efficiency. Elevate your projects with the 54AC11251FK and experience the ultimate in value and functionality.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides good thermal conductivity and durability, making the product reliable for high temperature and harsh environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost during production.

No. of Inputs: 8

Having 8 inputs provides flexibility and versatility in signal routing and processing, making the product suitable for complex applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems easier.

Propagation Delay (tpd): 7.5 ns

With a low propagation delay of 7.5 ns, this product enables fast data processing and signal transmission, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable in noisy environments.

Technical Specifications

Multiplexer & Demultiplexer 54AC11251FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

54AC11251FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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