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54AC11257J

Texas Instruments

54AC11257J by Texas Instruments

The Texas Instruments 54AC11257J is a CMOS multiplexer with 4 functions, 2 inputs, and 20 terminals. It has a propagation delay of 7.6 ns at 5V supply voltage, making it ideal for military-grade applications requiring fast signal switching in harsh environments. With a package style of IN-LINE and through-hole terminal form, this device offers reliable performance with a wide operating temperature range from -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,902 parts In-Stock

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Digiode

USA . 4,513 parts In-Stock

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4,513

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Distributors (Availability)

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AZTECH Wire

Italy . 849 parts In-Stock

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$6.216

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849

$6.216

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One Stop Electronics

USA . 988 parts In-Stock

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$8.000

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988

$8.000

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Parana Technologies

USA . 455 parts In-Stock

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$18.048

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$18.196

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455

$18.048

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DigiPath Technology Company

USA . 413 parts In-Stock

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$19.873

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$18.284

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413

$19.873

$18.284

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ChromeModa Solutions

Germany . 3,741 parts In-Stock

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$20.279

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$16.629

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3,741

$20.279

$16.629

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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$20.279

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$19.265

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$18.251

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748

$20.279

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$18.251

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Corphita

USA . 3,452 parts In-Stock

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Northwest PG Solutions

USA . 242 parts In-Stock

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Native Components

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Overview

Unlock the power of precision with the Texas Instruments 54AC11257J. Known for their top-notch quality and reliability, Texas Instruments brings you this versatile Multiplexer & Demultiplexer that is perfect for a wide range of applications. With fast propagation delay, multiple functions, and 3-state output characteristics, this component offers unmatched performance and efficiency. Whether you're working on military-grade projects or high-tech electronics, the 54AC11257J delivers exceptional value and benefits that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material : CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply : 7.6 ns

The low propagation delay ensures fast signal processing, which is crucial in applications where timing is critical.

No. of Functions : 4

Having 4 functions in one device provides flexibility and efficiency in circuit design, saving space and reducing component count.

Nominal Supply Voltage / Vsup (V) : 5

Operating at a nominal supply voltage of 5V allows compatibility with a wide range of systems and power sources.

Output Characteristics : 3-STATE

The 3-STATE output characteristics allow the outputs to be disabled, which can prevent bus contention and improve overall system performance.

Temperature Grade : MILITARY

Being designed for military-grade temperature range ensures reliability and performance in harsh operating environments.

Technology : CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Multiplexer & Demultiplexer 54AC11257J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

7.6 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

54AC11257J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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