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54AC11153J

Texas Instruments

54AC11153J by Texas Instruments

The Texas Instruments 54AC11153J is a CMOS dual-function multiplexer/demultiplexer with 4 inputs, operating at temperatures from -55°C to 125°C. It has 16 terminals in an in-line package style, suitable for military-grade applications requiring a power supply of 3.3/5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,634 parts In-Stock

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7,634

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Digiode

USA . 2,277 parts In-Stock

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2,277

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Distributors (Availability)

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Native Components

USA . 856 parts In-Stock

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$0.233

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-

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$0.224

856

$0.233

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$0.224

Northwest PG Solutions

USA . 1,952 parts In-Stock

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$0.256

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$0.226

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$0.256

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$0.226

AZTECH Wire

Italy . 789 parts In-Stock

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$6.475

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789

$6.475

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Parana Technologies

USA . 801 parts In-Stock

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$7.312

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$7.805

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801

$7.312

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$7.805

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DigiPath Technology Company

USA . 160 parts In-Stock

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$8.052

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$7.408

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160

$8.052

$7.408

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ChromeModa Solutions

Germany . 4,628 parts In-Stock

1+ parts

$8.216

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$6.737

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4,628

$8.216

$6.737

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IDEA Electronic Components Group

UK . 1,868 parts In-Stock

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$8.216

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$7.394

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1,868

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One Stop Electronics

USA . 1,141 parts In-Stock

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$48.000

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$48.000

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Corphita

USA . 1,765 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the 54AC11153J multiplexer & demultiplexer. This innovative product offers versatility and efficiency, making it ideal for a wide range of applications. With its durable ceramic package body material and military-grade temperature grade, you can trust in its performance even in the most demanding environments. Enhance your projects with the superior functionality and value that this Texas Instruments product delivers.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material for electronic components, offering good thermal properties and high resistance to stress and corrosion.

No. of Functions: 2

Having multiple functions in one device helps save space and reduce the need for additional components, making the product more efficient.

No. of Inputs: 4

Having multiple inputs allows for versatile signal routing and processing capabilities, making the product suitable for a variety of applications.

Package Shape: RECTANGULAR

Rectangular shape is practical and space-efficient, making it easy to integrate the product into existing systems or circuits.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages makes the product compatible with different systems and environments, providing flexibility in application.

No. of Terminals: 16

Having a sufficient number of terminals allows for easy connection and integration within a circuit or system, enhancing usability and practicality.

Package Style (Meter): IN-LINE

The in-line package style is space-saving and easy to install, offering convenience and efficiency in circuit design and implementation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand harsh conditions and operate reliably in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function in cold environments without sacrificing performance or reliability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and connection options, facilitating easy integration into diverse electronic systems.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and durability, making the product suitable for mission-critical applications and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making the product energy-efficient, reliable, and fast.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and secure connections, ensuring long-term reliability and durability in electronic systems.

Terminal Pitch: 2.54 mm

Having a standard terminal pitch simplifies PCB design and assembly, making the product compatible with common electronic components and manufacturing processes.

Technical Specifications

Multiplexer & Demultiplexer 54AC11153J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

54AC11153J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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