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54AC11151J

Texas Instruments

54AC11151J by Texas Instruments

The Texas Instruments 54AC11151J is a CMOS multiplexer with 8 inputs, 16 terminals, and a propagation delay of 12.9 ns. It operates at supply voltages of 3.3V to 5V, making it suitable for military-grade applications requiring fast signal switching in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,945 parts In-Stock

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Digiode

USA . 3,684 parts In-Stock

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3,684

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One Stop Electronics

USA . 1,541 parts In-Stock

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$3.000

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1,541

$3.000

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AZTECH Wire

Italy . 506 parts In-Stock

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$5.066

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506

$5.066

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Parana Technologies

USA . 524 parts In-Stock

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$20.010

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$19.943

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524

$20.010

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$19.943

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DigiPath Technology Company

USA . 926 parts In-Stock

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$22.033

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$20.271

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926

$22.033

$20.271

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ChromeModa Solutions

Germany . 3,543 parts In-Stock

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$22.483

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$18.436

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3,543

$22.483

$18.436

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IDEA Electronic Components Group

UK . 2,099 parts In-Stock

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$22.483

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$21.359

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$20.235

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2,099

$22.483

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Corphita

USA . 4,863 parts In-Stock

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Northwest PG Solutions

USA . 2,193 parts In-Stock

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Native Components

USA . 948 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality 54AC11151J multiplexer by Texas Instruments. Known for its reliable and efficient products, Texas Instruments delivers top-notch components that exceed industry standards. Ideal for applications requiring signal routing and selection, this multiplexer offers seamless performance and precision. With a wide operating temperature range and low power consumption, the 54AC11151J provides exceptional value to customers looking for durable and dependable solutions. Trust Texas Instruments for all your electronic needs and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed construction provides durability and protection for the internal components, ensuring long-term reliability.

No. of Inputs: 8

Having 8 inputs allows for versatile input configurations, making this multiplexer/demultiplexer suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with standard power sources, making integration easier.

Propagation Delay (tpd): 12.9 ns

The low propagation delay ensures efficient signal processing and minimal signal distortion, which is crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in demanding scenarios.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this multiplexer/demultiplexer energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer 54AC11151J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

12.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

54AC11151J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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