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54ACT11151FK

Texas Instruments

54ACT11151FK by Texas Instruments

54ACT11151FK by Texas Instruments is a CMOS multiplexer with 8 inputs, 11.3 ns propagation delay, and 24 Amp max I (ol). It is used in military-grade applications requiring fast signal switching within a temperature range of -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,360 parts In-Stock

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Vyrian

USA . 2,063 parts In-Stock

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One Stop Electronics

USA . 1,027 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$11.788

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Parana Technologies

USA . 2,280 parts In-Stock

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$17.020

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$17.242

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$17.020

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DigiPath Technology Company

USA . 903 parts In-Stock

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$18.742

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$17.242

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903

$18.742

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ChromeModa Solutions

Germany . 6,997 parts In-Stock

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$19.124

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$15.682

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$19.124

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IDEA Electronic Components Group

UK . 1,401 parts In-Stock

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$19.124

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$18.168

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$17.212

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Northwest PG Solutions

USA . 1,600 parts In-Stock

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$3.430

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Corphita

USA . 1,464 parts In-Stock

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Native Components

USA . 458 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the 54ACT11151FK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexers & demultiplexers that excel in a wide range of applications. With innovative technology and precision engineering, this product offers customers exceptional value, efficiency, and versatility. Whether you're in need of high-speed data processing or signal routing, trust Texas Instruments to provide the solutions you need for seamless integration and optimal performance. Elevate your projects with the trusted quality of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material ensures reliable performance and protection in various environmental conditions.

Propagation Delay At Nominal Supply: 11.8 ns

Low propagation delay ensures fast data transmission and efficient operation.

No. of Inputs: 8

Having 8 inputs allows for handling multiple signal sources efficiently.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage makes it compatible with common power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various industrial environments.

Technical Specifications

Multiplexer & Demultiplexer 54ACT11151FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.8 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

54ACT11151FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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