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54AC11253FK

Texas Instruments

54AC11253FK by Texas Instruments

The Texas Instruments 54AC11253FK is a CMOS multiplexer with 2 functions and 4 inputs. It has a propagation delay of 8.7 ns at 5V, operates in temperatures from -55 to 125 °C, and features a chip carrier package style. Ideal for military-grade applications requiring fast signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,283 parts In-Stock

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Digiode

USA . 2,513 parts In-Stock

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Native Components

USA . 76 parts In-Stock

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$1.840

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Northwest PG Solutions

USA . 876 parts In-Stock

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$2.024

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AZTECH Wire

Italy . 364 parts In-Stock

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$6.366

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Parana Technologies

USA . 1,621 parts In-Stock

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$27.812

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$40.285

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DigiPath Technology Company

USA . 122 parts In-Stock

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$30.624

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ChromeModa Solutions

Germany . 4,925 parts In-Stock

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$31.249

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$25.624

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IDEA Electronic Components Group

UK . 344 parts In-Stock

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$31.249

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$29.687

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$28.124

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One Stop Electronics

USA . 942 parts In-Stock

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$56.000

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Corphita

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Overview

Upgrade your electronic designs with the 54AC11253FK from Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers unmatched performance in the Multiplexer & Demultiplexer category. This versatile chip carrier offers 2 functions, 4 inputs, and a wide operating temperature range, making it perfect for military-grade applications. Experience faster data processing with a propagation delay of just 8.7 ns and take advantage of the 3-state output characteristics for added flexibility. Trust Texas Instruments to elevate your projects to the next level of efficiency and precision.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 8.7 ns

Offers fast signal processing which is essential in multiplexing and demultiplexing applications.

Surface Mount: YES

Facilitates easy installation on printed circuit boards.

No. of Functions: 2

Allows for versatile functionality in multiplexing and demultiplexing operations.

No. of Inputs: 4

Provides flexibility in handling multiple input signals.

Nominal Supply Voltage / Vsup (V): 5

Matches common supply voltages, enhancing compatibility with existing systems.

Load Capacitance (CL): 50 pF

Helps in maintaining signal integrity and reducing interference.

Power Supplies (V): 3.3/5

Supports multiple power supply options for versatility in different operating environments.

Package Style (Meter): CHIP CARRIER

Offers compact packaging for space-constrained applications.

Output Characteristics: 3-STATE

Enables high impedance state for bus sharing applications.

Temperature Grade: MILITARY

Certified for reliable operation in harsh environmental conditions.

Technology: CMOS

Utilizes low power consumption and high noise immunity characteristics.

Technical Specifications

Multiplexer & Demultiplexer 54AC11253FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS

Family:

AC

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

8.7 ns

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

54AC11253FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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