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VND830TR-E

STMicroelectronics

VND830TR-E by STMicroelectronics

VND830TR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and supports output currents up to 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,011 parts In-Stock

1+ parts

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4,011

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Anansix

USA . 2,266 parts In-Stock

1+ parts

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2,266

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Digiode

USA . 1,139 parts In-Stock

1+ parts

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1,139

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-

-

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ComSIT Distribution GmbH

Germany . 850 parts In-Stock

1+ parts

-

100+ parts

-

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850

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Pegasus Components GmbH

Germany . 556 parts In-Stock

1+ parts

-

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556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$12.680

100+ parts

-

1k+ parts

$11.412

10k+ parts

-

31

$12.680

-

$11.412

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AZTECH Wire

Italy . 1,113 parts In-Stock

1+ parts

$17.720

100+ parts

-

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10k+ parts

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1,113

$17.720

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Microchip USA

USA . 444 parts In-Stock

1+ parts

$18.178

100+ parts

-

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444

$18.178

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MKK Technologies

India . 811 parts In-Stock

1+ parts

$23.845

100+ parts

-

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811

$23.845

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DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

$23.845

100+ parts

-

1k+ parts

-

10k+ parts

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811

$23.845

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A-Z Elektronik GmbH

Germany . 4,905 parts In-Stock

1+ parts

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4,905

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Corphita

USA . 1,768 parts In-Stock

1+ parts

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1,768

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Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

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100+ parts

$15.161

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1,082

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$15.161

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iodParts Technologies Inc.

India . 850 parts In-Stock

1+ parts

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850

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Assy Fe

Spain . 42 parts In-Stock

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42

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Overview

Elevate your designs with the VND830TR-E from STMicroelectronics, a trusted leader renowned for its commitment to quality and innovation. This versatile peripheral driver combines robust protection features with efficient performance, ensuring reliability in demanding applications. With its compact design and dual-function capability, it simplifies integration while delivering outstanding value. Experience enhanced safety and performance—unlock your project’s potential with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight properties, making it suitable for various applications.

Surface Mount: YES

Surface mount capability facilitates easy integration into compact electronic designs, saving space on the PCB.

Maximum Supply Voltage: 36 V

A high maximum supply voltage allows for versatile use in different electronic systems, accommodating a wide range of applications.

No. of Functions: 2

Dual functionality enhances its utility, enabling design simplification by performing two tasks in a single component.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout and arrangement on PCBs, optimizing space and performance.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure reliability and longevity in operation, safeguarding against various electrical risks.

Power Supplies (V): 8/36

Supporting a range of 8V to 36V provides flexibility for use in different power supply systems, accommodating various designs.

No. of Terminals: 16

With 16 terminals, it allows for versatile connections and complex circuit designs, facilitating advanced functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency on PCBs, making it an excellent choice for compact devices.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage increases compatibility with a wider range of power sources, ensuring more design options.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish improves solderability and provides excellent corrosion resistance, enhancing durability.

Terminal Position: DUAL

Dual terminal positions enhance mounting flexibility, allowing for optimal layout and integration in various PCB designs.

Maximum Seated Height: 2.65 mm

The low seated height supports compact design requirements, making it ideal for modern slim product requirements.

Width: 7.5 mm

Compact width optimizes space utilization on the PCB, allowing for denser component placement.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with standard manufacturing processes, improving production efficiency.

Peak Reflow Temperature: 260 °C

Highest peak reflow temperature allows for compatibility with various soldering technologies, enhancing production flexibility.

Length: 10.3 mm

A compact length contributes to space efficiency in design, suitable for small form factor applications.

Maximum Output Current: 6 A

With a maximum output current of 6A, it can drive substantial loads, making it suitable for power-intensive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability on the PCB, enhancing the reliability of connections.

Nominal Supply Voltage: 13 V

A nominal voltage of 13V optimizes performance for many applications, striking a balance between efficiency and capability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for high-density placements on the PCB, supporting smaller devices without sacrificing connectivity.

Driver No. of Bits: 2

Two-bit driver capability supports basic logic functions while simplifying design and enhancing control precision.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, allowing it to be handled and stored effectively under normal conditions.

Nominal Output Peak Current Limit: 9 A

The ability to handle a nominal output peak current of 9A makes it suitable for demanding applications requiring high current delivery.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based peripheral driver, it ensures reliable signal integrity and switching capabilities, essential for peripheral interfacing.

Output Current Flow Direction: SOURCE

The sourcing output current direction enables effective control and integration in various electronic applications, enhancing its versatility.

Technical Specifications

Peripheral Drivers VND830TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

6 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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