Loading...

VND830MSP

STMicroelectronics

VND830MSP by STMicroelectronics

VND830MSP by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V, supporting automotive applications. It features built-in protections against overcurrent and thermal issues, ensuring reliability. With a compact design and dual terminal form, it efficiently handles output currents up to 9A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,931

-

-

-

-

Anansix

USA . 2,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,668

-

-

-

-

Digiode

USA . 2,194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,194

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,724 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

$3.951

10k+ parts

-

1,724

$4.390

-

$3.951

-

MKK Technologies

India . 212 parts In-Stock

1+ parts

$8.256

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$8.256

-

-

-

DigiPath Technology Company

USA . 212 parts In-Stock

1+ parts

$8.256

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$8.256

-

-

-

AZTECH Wire

Italy . 121 parts In-Stock

1+ parts

$14.920

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$14.920

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,619

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

-

-

-

-

Microchip USA

USA . 4,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,494

-

-

-

-

Corphita

USA . 4,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,396

-

-

-

-

Parana Technologies

USA . 1,643 parts In-Stock

1+ parts

-

100+ parts

$5.249

1k+ parts

-

10k+ parts

-

1,643

-

$5.249

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Elevate your projects with the VND830MSP from STMicroelectronics, a leading innovator in peripheral drivers. Designed for reliability and efficiency, this robust solution features advanced built-in protections against thermal, over-voltage, and current issues, ensuring durability across various applications. With a wide operating temperature range and compact design, it's perfect for automotive use, delivering exceptional performance with every connection. Experience peace of mind and superior quality that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this peripheral driver suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on printed circuit boards, optimizing space and enhancing reliability.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides versatility, enabling the driver to handle a wide range of applications without compromising performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and integration into circuit designs, particularly in space-constrained environments.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance the robustness and reliability of the driver, safeguarding it from various electrical faults and ensuring longevity.

Power Supplies (V): 13

A nominal supply voltage of 13 V aligns well with common automotive and industrial applications, making it suitable for a range of systems.

No. of Terminals: 10

Having 10 terminals provides ample connection points for various functionalities, allowing for flexibility in design and implementation.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs, making it easier to integrate into space-restricted environments.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows the driver to operate effectively in low-voltage environments, broadening its usability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in extreme conditions, making the driver suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures (-40 °C) guarantees stability and performance in harsh environments, essential for automotive and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finishes improve solderability and corrosion resistance, ensuring long-term reliability and performance of the connections.

Terminal Position: DUAL

Dual terminal position allows for easier routing of connections and better assembly efficiency on the printed circuit board.

Maximum Seated Height: 3.75 mm

A low seated height enables a compact design while allowing for stacked components, which is beneficial for high-density applications.

Width: 7.5 mm

A width of 7.5 mm supports compact designs while providing sufficient space for connections, enhancing integration capabilities.

Length: 9.4 mm

A manageable length of 9.4 mm allows for easy integration into circuit designs without taking up excessive board space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this temperature grade ensures that the device meets stringent industry standards for performance and reliability.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical strength and are easy to solder, contributing to the reliability of connections.

Nominal Supply Voltage: 13 V

Being optimized for a nominal supply voltage of 13 V makes this driver compatible with standard automotive power systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a compact layout while facilitating secure connections, making it suitable for high-density applications.

Driver No. of Bits: 2

With 2 bits, this driver can effectively control multiple devices, expanding its application scope in peripheral management.

Nominal Output Peak Current Limit: 9 A

A high peak current limit of 9 A supports demanding applications, providing the capability to drive multiple components or systems simultaneously.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile IC type allows for efficient interfacing of various components, improving system performance and reliability.

Output Current Flow Direction: SINK

The sink current flow direction is optimal for many peripheral applications, allowing for effective control and improved performance.

Technical Specifications

Peripheral Drivers VND830MSP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND830MSP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20