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VND830ASP

STMicroelectronics

VND830ASP by STMicroelectronics

VND830ASP by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V, built-in protections against overcurrent and thermal issues. It features a compact design (7.5mm x 9.4mm) and supports output currents up to 9A. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

Anansix

USA . 2,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,698

-

-

-

-

Digiode

USA . 1,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,034

-

-

-

-

Semi Source

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 556 parts In-Stock

1+ parts

$6.235

100+ parts

-

1k+ parts

$5.611

10k+ parts

-

556

$6.235

-

$5.611

-

MKK Technologies

India . 2,199 parts In-Stock

1+ parts

$11.724

100+ parts

-

1k+ parts

-

10k+ parts

-

2,199

$11.724

-

-

-

DigiPath Technology Company

USA . 2,199 parts In-Stock

1+ parts

$11.724

100+ parts

-

1k+ parts

-

10k+ parts

-

2,199

$11.724

-

-

-

AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$13.720

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$13.720

-

-

-

Microchip USA

USA . 259 parts In-Stock

1+ parts

$16.178

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$16.178

-

-

-

Ampacity Inc.

Singapore . 1,177 parts In-Stock

1+ parts

$29.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

$29.500

-

-

-

RC Electronics

USA . 38,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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38,000

-

-

-

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A-Z Elektronik GmbH

Germany . 4,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,811

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-

-

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Parana Technologies

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

$7.455

1k+ parts

-

10k+ parts

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1,471

-

$7.455

-

-

Corphita

USA . 1,325 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,325

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Overview

Unlock the power of precision with the VND830ASP from STMicroelectronics! This top-tier peripheral driver merges cutting-edge technology with robust protection features, ensuring reliable performance in any application. Designed for efficiency and versatility, it excels in automotive, industrial, and consumer electronics, delivering superior quality you can trust. Elevate your projects with a product that offers peace of mind, enhanced durability, and seamless integration into your designs. Experience excellence—choose VND830ASP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials contributes to the durability and lightweight design of the peripheral driver, making it suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates automated assembly, reducing manufacturing costs and improving reliability.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this driver can accommodate a wide range of applications without the risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on printed circuit boards (PCBs), making it ideal for compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections enhance reliability by safeguarding against common electrical issues, ensuring the longevity of the device.

Power Supplies (V): 13

A nominal supply of 13V provides a stable operating environment, ensuring optimal performance for various peripheral devices.

No. of Terminals: 10

With 10 terminals, this device allows for versatile connectivity options, enabling it to support complex configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package with heat sink/slug design effectively dissipates heat, improving overall efficiency and performance.

Minimum Supply Voltage: 5.5 V

The ability to operate at a minimum voltage of 5.5V allows for compatibility with a wide variety of systems and applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and enhances the reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design implementations, facilitating better circuit layout and optimization.

Maximum Seated Height: 3.65 mm

Compact height reduces the overall footprint, making it a great choice for space-constrained applications.

Width: 7.5 mm

A narrow width enables it to fit easily into tight spaces within electronic devices, promoting design versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature duration of 30 seconds is adequate for effective soldering, ensuring strong connections without damaging the component.

Peak Reflow Temperature °C: 250

Can withstand high reflow temperatures, making it compatible with modern soldering processes and materials.

Length: 9.4 mm

A moderate length contributes to the compact design, making it a smart choice for a wide range of electronic applications.

Terminal Form: GULL WING

Gull wing terminals promote easy handling and reliable soldering, improving the assembly process and ensuring a secure connection.

Nominal Supply Voltage: 13 V

With a nominal supply voltage of 13V, it ensures stable performance across a variety of conditions enhancing device reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides flexible layout options while maintaining robust electrical connections.

Driver No. of Bits: 2

A 2-bit driver configuration supports basic logic applications, making it versatile for various peripheral control tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, providing guidance for handling and storage to maintain quality.

Nominal Output Peak Current Limit: 9 A

A maximum output current limit of 9 A supports demanding applications, providing excellent performance for driving peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based driver, it is suitable for interfacing applications, enhancing signal integrity and control.

Output Current Flow Direction: SOURCE

The ability to source current allows the driver to actively power downstream devices, increasing versatility in applications.

Technical Specifications

Peripheral Drivers VND830ASP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830ASP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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