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VND830-E

STMicroelectronics

VND830-E by STMicroelectronics

VND830-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and output current up to 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,549 parts In-Stock

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8,549

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Digiode

USA . 4,031 parts In-Stock

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4,031

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Chip Stock

USA . 2,750 parts In-Stock

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2,750

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Anansix

USA . 2,114 parts In-Stock

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2,114

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ACDS - Activité Composants Distribution Service

France . 42 parts In-Stock

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42

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Bristol Electronics

USA . 42 parts In-Stock

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42

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Dan-Mar Components

USA . 42 parts In-Stock

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42

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Distributors (Availability)

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AZTECH Wire

Italy . 969 parts In-Stock

1+ parts

$11.000

100+ parts

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969

$11.000

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IDEA Electronic Components Group

UK . 305 parts In-Stock

1+ parts

$11.754

100+ parts

-

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$10.579

10k+ parts

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305

$11.754

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$10.579

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Ampacity Inc.

Singapore . 830 parts In-Stock

1+ parts

$16.500

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830

$16.500

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MKK Technologies

India . 1,503 parts In-Stock

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$22.102

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1,503

$22.102

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DigiPath Technology Company

USA . 1,503 parts In-Stock

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$22.102

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1,503

$22.102

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Microchip USA

USA . 613 parts In-Stock

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$56.654

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613

$56.654

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Assy Fe

Spain . 4,799 parts In-Stock

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Kepictronics

USA . 4,151 parts In-Stock

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Corphita

USA . 2,334 parts In-Stock

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2,334

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A-Z Elektronik GmbH

Germany . 2,058 parts In-Stock

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2,058

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Parana Technologies

USA . 1,343 parts In-Stock

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$14.054

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1,343

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$14.054

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iodParts Technologies Inc.

India . 42 parts In-Stock

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42

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Overview

Elevate your projects with the VND830-E from STMicroelectronics, a trusted leader in innovation. This powerful peripheral driver is designed for reliability and efficiency, boasting robust built-in protections against voltage spikes and thermal issues. Perfect for automotive, industrial, and consumer applications, it ensures optimal performance while simplifying design processes. Choose VND830-E to unlock unparalleled versatility and enhance the longevity of your devices!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the reliability and longevity of the component.

Surface Mount: YES

Surface mount technology allows for higher density circuit design, saving space on the PCB.

Maximum Supply Voltage: 36 V

A high maximum supply voltage ensures compatibility with a wide range of applications.

No. of Functions: 2

Having multiple functions in a single unit simplifies design and reduces component count.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and facilitates easier layout.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections enhance device safety and reliability, reducing the risk of damage in adverse conditions.

Power Supplies (V): 8/36

Flexible power supply options make it easy to integrate into various systems.

No. of Terminals: 16

A higher number of terminals offers greater connectivity options for complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for efficient operation in lower power environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design and improves thermal management.

Maximum Seated Height: 2.65 mm

A low seated height allows for low-profile designs, contributing to overall system size reduction.

Width: 7.5 mm

Compact width supports tighter spacing in PCB layouts, optimizing design efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A higher tolerance for peak reflow times supports various PCB assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with lead-free soldering processes.

Length: 10.3 mm

The moderate length strikes a balance between compactness and ease of handling during assembly.

Maximum Output Current: 6 A

A robust output current capability enables it to drive high-power peripherals effectively.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and provide mechanical stability.

Nominal Supply Voltage: 13 V

This optimal nominal voltage ensures efficient performance in a variety of applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with common PCB design tools and components.

Driver No. of Bits: 2

Having a two-bit driver ensures versatile control for different peripheral devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates appropriate handling requirements, promoting product longevity and reliability.

Nominal Output Peak Current Limit: 9 A

The high peak current limit supports demanding applications, ensuring reliable operation under load.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface type makes the product suitable for a wide range of functional applications.

Output Current Flow Direction: SOURCE

Source current flow direction allows for effective driving of loads, optimizing system performance.

Technical Specifications

Peripheral Drivers VND830-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

6 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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