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TN1215-800G

STMicroelectronics

TN1215-800G by STMicroelectronics

TN1215-800G by STMicroelectronics is a single SCR in a rectangular plastic package, ideal for high-voltage applications. It supports up to 800 V repetitive peak reverse voltage and 12 A max on-state current. With a max operating temp of 125 °C, it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,610 parts In-Stock

1+ parts

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3,610

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Anansix

USA . 1,822 parts In-Stock

1+ parts

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1,822

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Digiode

USA . 1,043 parts In-Stock

1+ parts

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1,043

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$1.844

100+ parts

-

1k+ parts

$1.659

10k+ parts

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2,320

$1.844

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$1.659

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MKK Technologies

India . 2,277 parts In-Stock

1+ parts

$3.467

100+ parts

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2,277

$3.467

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DigiPath Technology Company

USA . 2,277 parts In-Stock

1+ parts

$3.467

100+ parts

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2,277

$3.467

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Parana Technologies

USA . 362 parts In-Stock

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$2.204

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362

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$2.204

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Corphita

USA . 316 parts In-Stock

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316

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Overview

Experience unmatched reliability with the TN1215-800G from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance Silicon Controlled Rectifier (SCR) is designed for demanding applications, ensuring optimal efficiency and durability in various environments. With exceptional on-state current handling and minimal leakage, it enhances your circuit's performance while simplifying design. Elevate your projects with STMicroelectronics' trusted quality and experience seamless integration into power management systems or industrial automation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 0.2 mA

A low gate trigger current allows for efficient operation and minimizes power loss, which is crucial for energy-sensitive applications.

Configuration: SINGLE

The single configuration simplifies circuit design and is ideal for applications where space and complexity need to be minimized.

Non Repetitive Peak On-state Current: 146 A

This high peak current rating ensures reliable performance under transient conditions, making it suitable for high-power applications.

Surface Mount: YES

The surface mount feature allows for compact designs and automated assembly processes, improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards and accommodates efficient layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, facilitating robust connections.

Maximum On-state Current: 12 A

The 12 A on-state current rating ensures compatibility with various load requirements, making it versatile for numerous applications.

Maximum Leakage Current: 0.005 mA

A minimal leakage current enhances energy efficiency and reduces power loss in circuits, important for long-term reliability.

Repetitive Peak Reverse Voltage: 800 V

This robust voltage rating allows the device to handle high voltage applications, ensuring stability and safety.

Maximum Repetitive Peak Off-state Leakage Current: 5 uA

A very low leakage current during the off state enhances the product's efficiency and longevity by minimizing energy waste.

No. of Terminals: 2

The simple two-terminal design reduces complexity in circuit integration, simplifying installation and maintenance.

Package Style (Meter): SMALL OUTLINE

A small outline package style enables compact circuit designs while optimizing board space usage.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes this SCR suitable for demanding environments and enhances reliability.

Trigger Device Type: SCR

SCR technology provides high efficiency and reliability in controlling power, making it ideal for various industrial applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures functionality in harsh environments, expanding application possibilities.

Terminal Finish: Matte Tin (Sn) - annealed

This finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: SINGLE

A single terminal position simplifies circuit board design and layout, making assembly more efficient.

Maximum RMS On-state Current: 12 A

A reliable RMS current rating supports various load types, ensuring suitability for diverse applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low triggering voltage makes it easy to activate the SCR, ensuring seamless integration with low-voltage control circuits.

Case Connection: ANODE

Direct anode connection is straightforward for circuit integration, reducing potential installation errors.

Repetitive Peak Off-state Voltage: 800 V

This high off-state voltage rating ensures that the device can withstand high voltage spikes safely.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/µs

A fast critical rate of rise enhances protection against voltage transients, ensuring reliable performance.

Maximum Holding Current: 30 mA

A low holding current ensures the SCR can be turned off more easily, improving efficiency in control applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with modern SMT soldering processes, enhancing production yields.

Peak Reflow Temperature: 245 °C

A high peak reflow temperature tolerance indicates robustness to thermal stresses during manufacturing.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TN1215-800G attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

30 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

146 A

No. of Elements:

1

No. of Terminals:

2

Maximum On-state Current:

12 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Maximum Repetitive Peak Off-state Leakage Current:

5 uA

Repetitive Peak Off-state Voltage:

800 V

Repetitive Peak Reverse Voltage:

800 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

SCR

Trade Compliance

TN1215-800G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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